Patents Assigned to Dense-Pac Microsystems, Inc. a California corporation
  • Retaining ring interconnect used for 3-D stacking
    Publication number: 20030051903
    Abstract: A retaining ring interconnect. A retaining ring is formed on a perimeter of a pad on each of two adjoining surfaces of two PCB substrates. A conductive paste is applied between the pads on the two adjoining surfaces. The retaining rings are aligned and facing with each other. By performing a heat compression process, the retaining rings are connected to encompass the conductive paste. A eutectic bond is thus formed to bond the two PCB substrates.
    Type: Application
    Filed: April 8, 2002
    Publication date: March 20, 2003
    Applicant: Dense-Pac Microsystems, Inc. a California corporation
    Inventors: Glen E. Roeters, Frank E. Mantz