Patents Assigned to Designer Molecules Inc, Inc.
  • Materials and methods for stress reduction in semiconductor wafer passivation layers
    Patent number: 8710682
    Abstract: The present invention provides polyimide polymer materials for passivating semiconductor wafers and methods for fabricating thereof. The present invention further provides a device that includes a semiconductor wafer and a passivating layer disposed on the surface of the wafer, wherein the passivating layer comprises such polyimide polymers.
    Type: Grant
    Filed: March 15, 2013
    Date of Patent: April 29, 2014
    Assignee: Designer Molecules Inc, Inc.
    Inventors: Stephen M Dershem, Farhad G Mizori, James T Huneke
  • Maleimide-functional monomers in amorphous form
    Patent number: 8686162
    Abstract: The present invention provides amorphous maleimide-bismaleimide hybrid mixtures and methods for synthesizing such mixtures by condensation of diamine compounds with maleic anhydride along with one or more additional anhydrides. The invention provides a route to get passed the high melting point and the solubility issues of bismaleimide resins, yet to still obtain the good thermo-mechanical properties of these valuable molecules.
    Type: Grant
    Filed: August 25, 2011
    Date of Patent: April 1, 2014
    Assignee: Designer Molecules Inc, Inc.
    Inventor: Stephen M Dershem