Abstract: The invention is based on the discovery that a certain polyester compounds are useful as b-stageable adhesives for the microelectonic packaging industry. The polyester compounds described herein contain ring-opening or ring-forming polymerizable moieties and therefore exhibit little to no shrinkage upon cure. In addition, there are provided well-defined b-stageable adhesives useful in stacked die assemblies. In particular, there are provided assemblies wherein the b-stageable adhesive encapsulates a portion of the wiring members contained within the bondline gap between the stacked die.

Abstract: The invention is based on the discovery that certain well-defined crosslinkable polyester compounds are useful as components in mold compositions having increased adhesion to substrates, compared to mold compositions that do not contain the crosslinkable polyester compounds described herein.

Abstract: The present invention provides curatives for thermosetting adhesive compositions, methods of preparation and uses thereof. In particular, the present invention relates to elastomeric epoxy curative compounds that can be used in thermosetting compounds, methods for preparing the curative compounds and epoxy compositions containing the curative compounds.

Abstract: The invention provides epoxy and oxetane compositions including the novel acyloxy and N-acyl curing agents described herein. Use of invention curing agents result in cured adhesive compositions with remarkably increased adhesion and reduced hydrophilicity when compared to resins cured with other types of curing agents. Furthermore, the curatives of this invention do not interfere with free-radical cure and are thus suited for use in hybrid cure thermoset compositions.

Abstract: The invention is based on the discovery that certain crosslinkable functional groups can be incorporated into olefin oligomers, thereby making these functionalized olefin oligomers useful as thermosetting resin compositions. In particular, there are provided olefin oligomers containing pendant maleimide groups. These materials are readily prepared via cationic co-polymerization of cationically polymerizable olefin monomers and maleimide monomers containing a cationically polymerizable functional group.

Abstract: The invention is based on the discovery that certain polyester compounds bearing free-radical curable moieties are useful as b-stageable adhesives for the microelectronic packaging industry.

Abstract: The invention is based on the discovery that certain polyester-linked compounds are useful as components in underfill compositions for the microelectronic packaging industry.

Abstract: The invention is based on the discovery that certain well-defined functionalized cyclic siloxanes are useful as thermosetting resins for the electronic packaging industry. The functionalized cyclic siloxane compounds described herein can be cured in a variety of ways, depending on the polymerizable moiety incorporated into the compound. Invention cyclic siloxanes are readily prepared via hydrosilation of polyalkyl(hydro)cyclosiloxanes with appropriately functionalized alkenes and/or alkynes.

Abstract: A variety of curing agents for epoxy resins and methods for preparation thereof are disclosed, including compounds having the structures of formulas III and IV: wherein each of R1, R2, R3, R4, and R5 is independently selected from the group consisting of H, methyl, ethyl, n-propyl, iso-propyl, a butyl, and phenyl. Epoxy-based compositions including various curing agents are also disclosed. Other epoxy curatives containing amino, phenol, and/or imine groups are disclosed.

Abstract: The invention provides epoxy and oxetane compositions including the novel acyloxy and N-acyl curing agents described herein. Use of invention curing agents result in cured adhesive compositions with remarkably increased adhesion and reduced hydrophilicity when compared to resins cured with other types of curing agents. Furthermore, the curatives of this invention do not interfere with free-radical cure and are thus suited for use in hybrid cure thermoset compositions.

Abstract: The invention is based on the discovery that the compounds and compositions described herein are useful as film-forming adhesives for use in a variety of applications, including, for example, adhesive tapes for the electronic packaging industry. The invention compositions described herein can be cured in a variety of ways with or without a catalyst.

Abstract: The present invention is based on the discovery that certain electron poor olefins combined with nucleophiles and a base catalyst are useful as adhesive compositions for the electronic packaging industry. In particular, the adhesive formulations set forth herein are useful as low temperature curing formulations with high adhesion to a variety of substrates. Invention formulations typically cure at about 80° C. and have a potlife of about 24 hours. The formulations cure by the well-known Michael addition reaction.

Abstract: The present invention provides epoxy functional oligomeric compounds, methods of preparation and uses therefor. In particular, the present invention provides to oligomeric epoxy compounds derived from allyl glycidyl ether.

Abstract: Hyperbranched polymers and methods for preparing the same are disclosed. The polymers are obtained based on monomers synthesized via reacting a substituted or unsubstituted cyclic anhydride with a bifunctional amine.

Abstract: The present invention provides functionalized styrene oligomers and polymers prepared by Friedel-Crafts chemistry, as well as epoxidation products thereof. In particular, the invention provides allyl functional TPE. The invention also provides methods for making the functionalized styrene oligomers and polymers of the invention as well as epoxidation products thereof, compositions containing the same, and methods for using the functionalized and epoxified styrene oligomers that take advantage of the unique properties of the compounds and compositions of the invention.

Abstract: The invention provides novel siloxane monomers useful in a variety of adhesive applications. In one aspect, the siloxane compounds described herein can be used as Diels-Alder type curatives for bismaleimide or poly-maleimide monomers. The unsaturated resins shown here are attractive for use as maleimide curatives due to their poly-functionality. Each substituted styrenyl reside can react with two maleimide functional groups. Thus, an invention adhesive composition typically contains an excess of bismaleimide monomers.

Abstract: The invention provides hetero-functional compound compounds useful in a variety of adhesive applications. More particularly, the invention provides compounds bearing at least one electron rich olefinic bond and at least one electron poor olefinic bond, wherein the two olefinic bonds are separated by a C3 to about C500 aliphatic, cycloaliphatic, or aromatic spacer.

Abstract: The invention is based on the discovery that certain polyester compounds bearing free-radical curable moieties are useful as b-stageable adhesives for the microelectonic packaging industry.

Abstract: The invention is based on the discovery that a remarkable improvement in the performance of maleimide thermosets can be achieved through the incorporation of imide-extended mono-, bis-, or polymaleimide compounds. These imide-extended maleimide compounds are readily prepared by the condensation of appropriate anhydrides with appropriate diamines to give amine terminated compounds. These compounds are then condensed with excess maleic anhydride to yield imide-extended maleimide compounds.

Abstract: The invention is based on the discovery that a remarkable improvement in the performance of bismaleimide thermosets can be achieved through the incorporation of an imide-extended liquid bismaleimide monomer. This imide-extended liquid bismaleimide monomer is readily prepared by the condensation of an appropriate dianhydride with two equivalents of an appropriate diamine to give an amine terminated compound. This compound is then condensed with an excess of maleic anhydride to yield an imide-extended liquid bismaleimide monomer.