Patents Assigned to Dia Nippon Printing Co., Ltd.
  • Patent number: 7598025
    Abstract: The present invention is characterized to provide a hologram silver halide photographic material having high sensitivity and diffraction efficiency, providing an excellent image and having less color residue and noise in a transparent part, a hologram, a method for producing the same. In the present invention, a hologram silver halide photographic material having at least one silver halide emulsion layer formed on a support, wherein an average particle diameter of silver halide particles in a silver halide emulsion is 0.03 ?m to 0.07 ?m; a film thickness of the silver halide emulsion layer is 4 ?m to 9 ?m; a silver/gelatin ratio of the silver halide emulsion layer is 0.3 to 0.6; and the silver halide emulsion layer contains sensitizing dye of specific structure.
    Type: Grant
    Filed: January 17, 2007
    Date of Patent: October 6, 2009
    Assignees: Konica Minolta Opto Inc., Dia Nippon Printing Co., Ltd.
    Inventors: Kenji Michiue, Tomonobu Moriya, Masashi Iwasaki, Toshihiro Kubota, Masachika Watanabe, Tsuyoshi Yamauchi, Tomoko Kumasawa, Kenji Ueda
  • Patent number: 6872646
    Abstract: A conductive pattern is obtained by forming concave-convex on a substrate by using a pattern substrate. A conductive thin layer is formed and then coated with a layer of a photosensitive resin. The photo sensitive resin is exposed and development by using the pattern substrate to bare the conductive thin layer on the convex portion and electrolytic plating. The conductive thin layer and the layer of the photosensitive resin on the concave portion may then be removed.
    Type: Grant
    Filed: June 3, 2003
    Date of Patent: March 29, 2005
    Assignee: Dia Nippon Printing Co., Ltd.
    Inventor: Yudai Yamashita
  • Patent number: 5940184
    Abstract: A photographic method for controlling characteristics of an image to be recorded by changing the conditions for voltage application and achieves image recording by setting application voltage in accordance with image characteristics as desired. The range of external application voltage is set according to resistance of the liquid crystal medium, threshold voltage of the liquid crystal medium, and base current of a photo sensor, and the application voltage is changed according to the desired image characteristics within the preset range.
    Type: Grant
    Filed: March 28, 1996
    Date of Patent: August 17, 1999
    Assignee: Dia Nippon Printing Co., LTD.
    Inventor: Masato Okabe
  • Patent number: 5583670
    Abstract: The information recording medium of the present invention comprises an information recording layer made of acrylic resin or metacrylic resin 11 being laminated on an electrode layer 13, a liquid crystal phase 12 being dispersed and fixed on said information recording layer, whereby said acrylic resin or metacrylic resin has weight average molecular weight of 10,000 to 100,000, electrostatic information can be permanently recorded and stored as visible information, and the visible information can be reproduced at any desired time. Further, the visible information can be easily erased by heating, and medium can be re-used.
    Type: Grant
    Filed: September 10, 1993
    Date of Patent: December 10, 1996
    Assignee: Dia Nippon Printing Co., Ltd.
    Inventors: Masayuki Iijima, Yuichi Nakayasu
  • Patent number: 5448105
    Abstract: A leadframe according to this invention is formed by bonding a single leadframe with a substrate using adhesive film or double-sided adhesive resin film, which is divided and attached to two or more predetermined points between them. This reduces the quantity of gas or contaminants generated from adhesives. Also, this results in the reduction of the stress generated during heat treatment of the leadframe and also in the elimination of warping of the lead frame due to thermal stress. Cracking does not occur on the resin because resin is removed easily and assuredly, and no air is left behind. This contributes to high reliability and increased productivity. The lead frame is further formed by bonding a plurality of metal substrates of different materials to single leadframe. This through more stable thermal behavior high reliability.
    Type: Grant
    Filed: January 17, 1995
    Date of Patent: September 5, 1995
    Assignees: Dia Nippon Printing Co., Ltd., Hitachi, Ltd., Hitachi VLSI Engineering Corp.
    Inventors: Kazunori Katoh, Gen Murakami, Hiromichi Suzuki, Takayuki Okinaga, Takashi Emata, Osamu Horiuchi