Patents Assigned to Digital Tags Finland, OY
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Patent number: 11981481Abstract: A substantially cylindrical, metal container (1) which container comprising an envelope surface wall (2), a top end and a bottom end (3), wherein the bottom end having a cavity which is formed by a circular concave, parabolic bottom surface (4) and a circular surrounding edge (5). A UHF RFID tag (6), comprising an integrated circuit (7) and an antenna (8), is arranged at the bottom end, wherein the antenna is located at a predetermined distance above the center of the bottom surface (4), such that the bottom surface reflects the antenna radiation.Type: GrantFiled: July 2, 2019Date of Patent: May 14, 2024Assignee: Digital Tags Finland, OYInventors: Lauri Huhtasalo, Elham Moradi
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Patent number: 11928536Abstract: The present invention relates to an RFID label comprising an RFID tag which tag comprises an RFID antenna and an IC, which IC is attached onto the antenna such that the antenna and the IC forms the RFID tag. The inventive label further comprising an elongated substrate with a first surface and a second surface, wherein the first surface is siliconized, and the second surface is carrying the RFID tag, and a sticky adhesive layer which is arranged onto the second surface of the substrate and over the RFID tag.Type: GrantFiled: November 4, 2020Date of Patent: March 12, 2024Assignee: DIGITAL TAGS FINLAND OYInventors: Lauri Huhtasalo, Juha Ikonen
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Patent number: 11881126Abstract: The present invention relates to a baggage tag (1) to be fastened to a luggage, such that the luggage can be tracked and traced via the baggage tag. The baggage tag comprising a face material (5) with a first side (6) and a second side (7). A liner (8) with a first side (9) and a second side (10), wherein the first side is siliconized and facing against the second side (7) of the face material (5); and a pressure sensitive adhesive layer (11), which is arranged between the second side of the face material and the first side of the liner. The baggage tag further comprising an RFID tag which tag comprises an RFID antenna (3) and an IC (4) attached onto the antenna such that the antenna and the IC form the RFID tag and wherein the RFID antenna is formed directly onto the second side of the liner.Type: GrantFiled: March 7, 2022Date of Patent: January 23, 2024Assignee: Digital Tags Finland OyInventor: Lauri Huhtasalo
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Publication number: 20230040740Abstract: Method for producing an electrically conductive pattern on a substrate, wherein the method comprising the steps of forming an adhesive layer in a predetermined pattern on a substrate, adding electrically conductive solid particles onto the adhesive layer, wherein the particles stick onto the adhesive, heating the solid particles with electromagnetic radiation wherein the wavelengths of the electromagnetic spectrum are in the range 600-1400 nm, preferably in the range 700-1200 nm, such that the temperature of the particles exceeding their characteristic melting point, and pressing the heated particles against the substrate in a nip, wherein the particles are flattened, such that the particles electrically connect to each other and thereby form the conductive pattern.Type: ApplicationFiled: December 17, 2020Publication date: February 9, 2023Applicant: DIGITAL TAGS FINLAND OYInventors: Lauri HUHTASALO, Kaj BACKFOLK
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Patent number: 11544515Abstract: Method and apparatus for producing RFID transponders (400) arranged on a carrying substrate, comprising:providing a first substrate (100), the first substrate having at least one antenna element (101) arranged thereon, and preferably several antenna elements arranged sequentially thereon along a longitudinal extension of the first substrate, each antenna element being formed by an electrically conductive pattern; providing a second substrate (200), the second substrate (200) having at least one RFID strap, each RFID strap comprising an IC (202) and at least one contact pad (201) coupled to the IC, and preferably several RFID straps being arranged sequentially along a longitudinal extension of the second substrate; and electrically connecting an antenna element (101) on the first substrate to the at least one contact pad on the second substrate by bringing said first and second substrates together, thereby bringing said antenna element in mechanical contact with said at least one contact pad, and heating the cType: GrantFiled: October 9, 2018Date of Patent: January 3, 2023Assignee: Digital Tags Finland, OYInventors: Lauri Huhtasalo, Juha Maijala
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Publication number: 20220414412Abstract: The present invention relates to an RFID label comprising an RFID tag which tag comprises an RFID antenna and an IC, which IC is attached onto the antenna such that the antenna and the IC forms the RFID tag. The inventive label further comprising an elongated substrate with a first surface and a second surface, wherein the first surface is siliconized, and the second surface is carrying the RFID tag, and a sticky adhesive layer which is arranged onto the second surface of the substrate and over the RFID tag.Type: ApplicationFiled: November 4, 2020Publication date: December 29, 2022Applicant: DIGITAL TAGS FINLAND OYInventors: Lauri HUHTASALO, Juha IKONEN
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Publication number: 20220405543Abstract: An antenna for an RFID (Radio Frequency Identification) tag comprises two antenna parts being arranged at opposite end areas of the antenna, and at least one intermediate part forming a bridge between the antenna parts. One of the at least one intermediate part comprises power feeding areas to be connected to an integrated circuit. Further, a first gap is arranged in one of the at least one intermediate part, and has a gap length of less than 80 ?m, which forms a low impedance path for current at microwave frequencies.Type: ApplicationFiled: October 20, 2020Publication date: December 22, 2022Applicant: DIGITAL TAGS FINLAND OYInventors: Ilkka YLI-PELTOLA, Lauri HUHTASALO, Antti LESKELĂ„
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Publication number: 20220374671Abstract: An RFID tag is disclosed comprising a dielectric substrate having a first side and an opposite second side, and with an antenna arranged on the first side of the dielectric substrate. The antenna defines a gap and is configured to operate at an operation frequency. The RFID tag further comprises an RFID chip electrically coupled to the antenna across the gap. A shielding conductor is arranged on the second side of the dielectric substrate, and preferably underlaying the gap, wherein the shielding conductor is configured to limit the voltage across the gap when the antenna is exposed to a microwave frequency of a microwave oven.Type: ApplicationFiled: October 20, 2020Publication date: November 24, 2022Applicant: DIGITAL TAGS FINLAND OYInventors: Lauri HUHTASALO, Ilkka YLI-PELTOLA
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Publication number: 20220309960Abstract: The present invention relates to a baggage tag (1) to be fastened to a luggage, such that the luggage can be tracked and traced via the baggage tag. The baggage tag comprising a face material (5) with a first side (6) and a second side (7). A liner (8) with a first side (9) and a second side (10), wherein the first side is siliconized and facing against the second side (7) of the face material (5); and a pressure sensitive adhesive layer (11), which is arranged between the second side of the face material and the first side of the liner. The baggage tag further comprising an RFID tag which tag comprises an RFID antenna (3) and an IC (4) attached onto the antenna such that the antenna and the IC form the RFID tag and wherein the RFID antenna is formed directly onto the second side of the liner.Type: ApplicationFiled: March 7, 2022Publication date: September 29, 2022Applicant: Digital Tags Finland OyInventor: Lauri HUHTASALO
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Patent number: 11244220Abstract: Method for manufacturing an RFID tag comprising an IC and an antenna. The method comprising the steps of providing an antenna made of a soldering material, which antenna is at least partly covered with a hot melt adhesive in solid form; heating the antenna to a temperature above its melting point, wherein the heated parts of the antenna and the hot melt adhesive melt, placing an IC in a predetermined position which position is suitable for the IC to connect to the antenna; pressing the IC and antenna together, such that, an electrical connection between the IC and the antenna is established; and cooling RFID tag, such that the hot melt adhesive and the antenna solidify, wherein a soldered joint between the IC and the antenna is achieved and the hot melt adhesive surrounds the joint between the IC and the antenna.Type: GrantFiled: October 31, 2018Date of Patent: February 8, 2022Assignee: Digital Tags Finland, OYInventors: Lauri Huhtasalo, Eerik Halonen, Juha Ikonen