Abstract: A method of laser marking substrates such as glass, ceramic, metal and plastic is disclosed. A marking material is applied to the surface of the substrate, followed by irradiation of a portion of the marking material to form a permanent marking on the substrate. The non-irradiated portion of the marking material is then removed from the substrate. The marking material may comprise glass frit or precursors thereof, inorganic pigments or precursors thereof, silicates, metal oxides, sulfides, nitrides and carbides, organometallic materials or metal powders. The marking method is highly versatile, can be performed quickly, and produces permanent marks of high resolution and contrast without damage to the substrate.