Abstract: A laminated film for an eco-friendly packaging material, according to one embodiment, comprises: a paper layer for blocking oxygen and moisture; and a film layer that can be biodegraded or biologically disintegrated by means of at least one from among microorganisms, moisture, oxygen, light and heat, wherein the oxygen transmission rate of the laminated film can be 0.01-1 cc/m2 per day, and the moisture transmission rate thereof can be 0.01-1 cc/m2 per day.
Abstract: A laminated film for an eco-friendly packaging material, according to one embodiment, comprises: a paper layer for blocking oxygen and moisture; and a film layer that can be biodegraded or biologically disintegrated by means of at least one from among microorganisms, moisture, oxygen, light and heat, wherein the oxygen transmission rate of the laminated film can be 0.01-1 cc/m2 per day, and the moisture transmission rate thereof can be 0.01-1 cc/m2 per day.
Abstract: The example embodiments relate to a lid packing material for food container, and a lid packing material for food container according to an aspect of the example embodiments includes: a substrate layer; and a heat-adhesion layer formed on the substrate layer, wherein the heat-adhesion layer includes at least two types of wax having different melting points.
Abstract: Disclosed is an eco-friendly packaging. The eco-friendly packaging with an accommodation space is formed by bonding multilayer films, and the multilayer films each include a first layer including a base layer including oriented polypropylene, and a coating layer applied to the outer surface of the base layer by coating, and a second layer laminated on the inner surface of the base layer, the second layer including cast polypropylene.
Type:
Application
Filed:
March 4, 2021
Publication date:
October 21, 2021
Applicant:
DONGWON SYSTEMS CORPORATION
Inventors:
Sung Ji Choi, Jin Seok Choi, Do Yeon Kim
Abstract: Disclosed are an eco-friendly container label and a method of manufacturing an eco-friendly container. The eco-friendly container label to be attached to a disposable container includes a first layer including a print layer, and a barrier layer stacked on one side of the print layer, a second layer including an adhesive layer formed of the same material as the print layer, the adhesive layer to be stacked on the surface of the disposable container, and an intermediate base layer stacked between the first layer and the second layer and configured to bond the adhesive layer and the print layer.
Abstract: The present inventive concept is a hyuntak transistor that can prevent a thermal runaway phenomenon and a low heat high efficiency constant current circuit using an auxiliary transistor capable of a high amplification and a constant current. The circuit may be applied to drive a LED and a motor.
Type:
Grant
Filed:
January 12, 2012
Date of Patent:
October 21, 2014
Assignees:
Electronics and Telecommunications Research Institute, Dongwon Systems Corporation
Inventors:
Hyun-Tak Kim, Bongjun Kim, Sun Shin Kwag, Jun Sik Kim
Abstract: The present inventive concept is a hyuntak transistor that can prevent a thermal runaway phenomenon and a low heat high efficiency constant current circuit using an auxiliary transistor capable of a high amplification and a constant current. The circuit may be applied to drive a LED and a motor.
Type:
Application
Filed:
January 12, 2012
Publication date:
October 24, 2013
Applicant:
DONGWON SYSTEMS CORPORATION
Inventors:
Hyun-Tak Kim, Bongjun Kim, Sun Shin Kwag, Jun Sik Kim