Abstract: An underfill film for semiconductor packages and a method for manufacturing a semiconductor package using the underfill film are disclosed. The underfill film includes an adhesive layer in which a melt viscosity and an onset temperature are adjusted to a predetermined range such that production efficiency may be improved by simplifying packaging process of the semiconductor packages. Also the underfill film and the manufacturing process may improve connection reliability of the package.

Abstract: A polyamic acid resin is copolymerized including: at least one diamine; at least one acid dianhydride; and polyhedral oligomeric silsesquioxane, and a transparent polyimide film is formed using the polyamic acid resin. The transparent polyimide film secures both excellent optical and mechanical properties through organic-inorganic hybrid formation, thus being applicable as a cover window for display devices.

Abstract: A resin composition, a metal laminate, and a printed circuit board which use the resin composition are disclosed. A method for manufacturing the metal laminate is also disclosed. The resin composition contains at least one elastomer selected from the group consisting of a fluoroelastomer or a styrene-based elastomer; a fluororesin filler; and an inorganic filler.

Abstract: A forklift truck includes a carriage that moves up and down by a mast assembly in a multi-stage structure including an outer mast, a first inner mast accommodated in the outer mast, and a second inner mast accommodated in the first inner mast. The forklift truck includes a first lift cylinder configured to move the first inner mast up and down; a second lift cylinder configured to move the second inner mast up and down and having a pressure reception area less than a pressure reception area of the first lift cylinder. A first lift hydraulic line supplies hydraulic oil to the first lift cylinder. A second lift hydraulic line supplies hydraulic oil to the second lift cylinder. A pressure regulating valve is provided to increase a pressure of the hydraulic oil to a pressure capable of driving the second lift cylinder.

Abstract: The present invention relates to a method for manufacturing a double access flexible printed circuit board, having excellent mass production and cost-reduction effects by a roll-to-roll (R2R) process throughout the entire process, and a double access flexible printed circuit board manufactured by the method.

Abstract: An adhesive composition, and a coverlay film and a printed circuit board that include the adhesive composition are disclosed. The adhesive composition includes: (a) an epoxy resin; and (b) a binder resin including epoxidized polybutadiene rubber and at least two kinds of rubber. The adhesive composition can form an adhesive layer superb in terms of adhesiveness, fluidity, filling properties (landfilling), migration resistance, heat resistance, flame retardancy, low elongation, and flexibility.

Abstract: A laminator is disclosed. The laminator includes a substrate supply part for supplying a substrate on which a metal pattern is formed; a coverlay supply part for supplying a film to which a plurality of coverlays is attached; a heating roller part for bonding the substrate and the film so that the plurality of coverlays respectively covers the metal pattern; a substrate tension adjustment part and a film tension adjustment part; a bonding state image photographing part for measuring an interval between the plurality of coverlays after the substrate and the film are bonded; and an adjustment part for adjusting the substrate tension adjustment part or the film tension adjustment part so that the interval between the plurality of coverlays measured by the bonding state image photographing part maintains a preset allowable interval.

Abstract: An underfill film for a semiconductor package and a method for manufacturing a semiconductor package using the underfill film are disclosed. The underfill film is suitable for a semiconductor package, which, by including an adhesive layer having low lowest melt viscosity, can improve the connection reliability of a package by minimizing the formation of voids during semiconductor packaging.

Abstract: A system for manufacturing a printed circuit board includes a coverlay supply apparatus configured to supply a coverlay; a printed circuit board supply apparatus configured to supply a printed circuit board; and a pre-bonding apparatus configured to pre-bond the coverlay supplied from the coverlay supply apparatus onto the printed circuit board supplied from the printed circuit board supply apparatus, thereby discharging a first composite board.

Abstract: The present invention relates to a system for manufacturing a composite substrate, the system comprising: a hot-press device which hot-presses a first composite substrate comprising a printed circuit board and a coverlay temporarily attached thereto to form a second composite substrate, and discharges the second substrate therefrom; and a transfer device which transfers the first substrate into the hot press device while regulating the amount of supplied first composite substrates.

Abstract: An adhesive composition, a coverlay film containing the adhesive composition, and a printed circuit board containing the coverlay film are disclosed. The adhesive composition includes an epoxy resin, a binder resin containing at least one species of rubber, and an inorganic filler. The adhesive composition has a viscosity of at most 8,000 cps.

Abstract: An apparatus for controlling vehicle motors based on a battery temperature includes: a battery temperature sensor unit for measuring a temperature of a battery pack of an industrial vehicle; a battery monitoring unit for monitoring a measured value of the temperature sensor unit, and for transmitting temperature information when the temperature of the battery pack is out of a reference value that is predetermined; a vehicle control unit for restricting driving of a motor that receives a power from the battery pack based on the temperature information; and a fan control unit for controlling driving of a fan that cools the battery pack based on the temperature information.

Abstract: The present disclosure relates to a fork movement control device. A fork movement control device according to an exemplary embodiment of the present disclosure may control and simultaneously move two forks by manipulating a single lever.

Abstract: An underfill film for semiconductor packages and a method for manufacturing a semiconductor package using the underfill film are disclosed. The underfill film includes an adhesive layer in which a melt viscosity and an onset temperature are adjusted to a predetermined range such that production efficiency may be improved by simplifying packaging process of the semiconductor packages. Also the underfill film and the manufacturing process may improve connection reliability of the package.

Abstract: The present disclosure is related to a system for regenerating a DPF and a method thereof. The system for regenerating a DPF during operation of an engine-powered forklift that includes the DPF for collecting particulate matter form exhaust gas discharged from an engine to an exhaust path includes: an engine control unit for controlling operation of the engine; an electro-hydraulic pump for discharging a working fluid that generates a hydraulic load; a control unit for determining a state of the forklift when a DPF regeneration request signal is received from the engine control unit, and controlling at least one of the hydraulic load of the electro-hydraulic pump and revolutions per minute of the engine according to the determined state of the forklift; and a diesel oxidation catalyst unit for regenerating the DPF according to the control of the control unit.

Abstract: A resin composition, a metal laminate, and a printed circuit board which use the resin composition are disclosed. A method for manufacturing the metal laminate is also disclosed. The resin composition contains at least one elastomer selected from the group consisting of a fluoroelastomer or a styrene-based elastomer; a fluororesin filler; and an inorganic filler.

Abstract: A non-conductive adhesive film for semiconductor packages and a method of manufacturing a semiconductor package using the non-conductive adhesive film are disclosed. The non-conductive adhesive film for semiconductor packages includes a base; and an adhesive layer disposed on one surface of the base and having a storage modulus in a range of 2 to 4 GPa at 25° C.

Abstract: The present disclosure relates to an ISG control system and an ISG control method for a construction machine capable of controlling ISG even in a working state of a construction machine, the ISG control system including: a surrounding environment determinator configured to determine surrounding environment of the construction machine; and a vehicle controller configured to determine whether the construction machine is in a working state or a traveling state based on a determination result from the surrounding environment determinator, wherein the vehicle controller controls an engine based on a preset work ISG condition when it is determined that the construction machine is in the working state, and wherein the vehicle controller controls the engine based on a preset travel ISG condition when it is determined that the construction machine is in the traveling state.

Abstract: A forklift truck includes a carriage that moves up and down by a mast assembly in a multi-stage structure including an outer mast, a first inner mast accommodated in the outer mast, and a second inner mast accommodated in the first inner mast. The forklift truck includes a first lift cylinder configured to move the first inner mast up and down; a second lift cylinder configured to move the second inner mast up and down and having a pressure reception area less than a pressure reception area of the first lift cylinder. A first lift hydraulic line supplies hydraulic oil to the first lift cylinder. A second lift hydraulic line supplies hydraulic oil to the second lift cylinder. A pressure regulating valve is provided to increase a pressure of the hydraulic oil to a pressure capable of driving the second lift cylinder.

Abstract: Disclosed is an industrial vehicle work guide system. An industrial vehicle work guide system according to an embodiment of the present invention includes: a memory configured to store engine used data, a driving time, a fuel consumption amount, and reference fuel efficiency; a display module configured to output a guide message; and an analysis module configured to calculate actual fuel efficiency by using the engine used data, the driving time, and the fuel consumption amount, compare the actual fuel efficiency with the reference fuel efficiency, and control the display module so that the display module outputs a guide message when the actual fuel efficiency is lower than the reference fuel efficiency.