Abstract: A highly thermally conductive composition is provided, such composition comprising: (A) An organopolysiloxane composition; (B) a filler treating agent; (C) a thermal stabilizer; and (D) thermally conductive filler mixture, comprising: (D-1) a small-particulate thermally conductive filler having a mean size of up to 3 ?m, (D-2) spherical aluminum nitride having a mean size of from 50 to 150 ?m, (D-3) boron nitride having a mean size of from 20 to 200 ?m.

Abstract: A silicon glycan is provided. The silicon glycan comprises a glycoside moiety, independently selected organosilicon moieties, and beta-amino alcohol moieties joining the organosilicon moieties to the glycoside moiety. The glycoside moiety comprises independently selected saccharide moieties, which may be substituted with hydrocarbyl groups, ether moieties, and/or amine moieties. A method of preparing the silicon glycan is also provided. The method includes reacting (A) an aminoethyl polysaccharide and (B) an epoxide-functional organosilicon compound, to give the silicon glycan. The method may include preparing the aminoethyl polysaccharide (A) by first reacting (At) a hydroxyl-functional polysaccharide and (A2) an aziridinium halide compound to give the aminoethyl polysaccharide (A).

Abstract: A method for producing a thixotropic curable silicone composition is provided. The curable silicone composition comprises: (A) a silicone base material comprising: an organopolysiloxane having at least two alkoxysilyl-containing groups per molecule and a filler other than fumed silica; (B) a hydrophobic fumed silica; (C) a carbasilatrane derivative; (D) an alkoxysilane or its partial hydrolysis and condensation product; and (E) a condensation reaction catalyst. The method comprises the following steps: (I) mixing components (A) and (B); (II) mixing component (C) with a mixture obtained by step (I); and (III) mixing components (D) and (E) with a mixture obtained by step (II) under free of moisture. The curable silicone composition obtained by the method has an excellent thixotropic property and can cure at room temperature by contact with moisture in air.

Abstract: A curable coating composition is provided having multi-functionalized acrylic copolymer and amino-functional silicone resin curing agents. The acrylic copolymer of the curable coating composition has, in polymerized form, epoxy functionalized groups and cure compatibility groups. The coating compositions are useful in the field of superior weatherable and durable coatings and are useful to replace isocyanate-containing polyurethane based coatings. Also provided are coated articles produced from the curable composition.

Abstract: A composition contains: (a) a first organopolysiloxane with an average of 2 or more mercaptoalkyl groups per molecule and that is free of alkenyl functionality; (b) a second organopolysiloxane with an average of one or more alkenyl group and one or more alkoxy group per molecule; (c) a tetraalkoxy silane; (d) an ultraviolet light photoinitiator; and (E) a condensation catalyst; where the concentration of the first and second organopolysiloxanes are such that the molar ratio of mercaptoalkyl groups to alkenyl groups is in a range of 0.4 to 3.0.

Abstract: A polydiorganosiloxane is useful in a composition and a method for preparing a wood plastic composite article. The wood plastic composite article is useful as a building material. The polydiorganosiloxane may be added to the composition in liquid form or may form part of a solid carrier component used to make the wood plastic composite article.

Abstract: A composition comprises: a branched organosilicon compound; an acrylate-functional compound other than the branched organosilicon compound; and optionally a carrier vehicle. The branched organosilicon compound has the following general formula (I): (R1)3Si—X (I); where X comprises a acryloxy-functional moiety, and each R1 is selected from —OSi(R4)3 and R, with the proviso that at least one R1 is —OSi(R4)3; where each R is a substituted or unsubstituted hydrocarbyl group; where each R4 is selected from R, —OSi(R5)3, and —[OSiR2]mOSiR3; where each R5 is selected from R, —OSi(R6)3, and —[OSiR2]mOSiR3; where each R6 is selected from R and —[OSiR2]mOSiR3; with the proviso that at least one of R4, R5 and R6 is —[OSiR2]mOSiR3; and where 0?m?100. A method of preparing a copolymer is further provided.

Abstract: Provided are an assembly and process for the continuous or semi-continuous preparation of addition-crosslinking liquid silicone rubbers and to liquid silicone rubber compositions made therefrom. Also disclosed are articles made from the liquid silicone rubber compositions.

Abstract: Various embodiments described herein are directed to a polymer composition comprising polyethylene and a reaction product of the copolymerization of the ethylene and (meth)acrylic ester functionalized polysiloxane, and optionally one or more units derived from a termonomer. Articles made from the polymer composition and methods of making the polymer composition are also described.

Abstract: A silicone pressure sensitive adhesive composition is curable to form a silicone pressure sensitive adhesive. The silicone pressure sensitive adhesive composition can be coated on a substrate and cured to form a protective film. The protective film can be adhered to an anti-fingerprint coating on display glass, such as cover glass for a smartphone.

Abstract: A thermally conductive silicone composition is provided. The composition comprises: (A) an alkenyl group-containing organopolysiloxane; (B) an organohydrogenpolysiloxane having an average of two to four silicon-bonded hydrogen atoms in a molecule, wherein an amount of the silicon-bonded hydrogen atoms in component (B) is 0.2 to 5 moles per mole of the alkenyl groups in component (A), and at least two of the silicon-bonded hydrogen atoms are located on the side chains of the molecule; (C) a hydrosilylation reaction catalyst; (D) a thermally conductive filler; (E) an alkoxysilane having an alkyl group containing 6 or more carbon atoms in a molecule; and (F) glass beads. A thermally conductive member is produced from the thermally conductive silicone composition. An electronic device has the thermally conductive member and a manufacturing method of the electronic device includes using the thermally conductive silicone composition.

Abstract: Described herein is a two-part condensation curable adhesive composition suitable for adhering a front lens having an inner surface coated with an anti-haze coating to a lamp body to create a sealed lamp unit. In general, once cured in place, residual ingredients from the adhesive composition or by-products of cure reactions thereof do not visibly inhibit functionality of the anti-haze coating of the sealed lamp unit.

Abstract: A polyorganosiloxane hot melt adhesive composition includes a polyolefin-polydiorganosiloxane block copolymer, a polydiorganosiloxane, and a polyorganosilicate resin. The hot melt adhesive composition is useful in electronic device assembly processes.

Abstract: A fabric care composition is provided including water; a cleaning surfactant; a fabric softening silicone; and a modified carbohydrate polymer having a weight average molecular weight of <500,000 Daltons and a Kjeldahl nitrogen content corrected for ash and volatiles, TKN, of ?0.5 wt %; wherein the modified carbohydrate polymer is a carbohydrate polymer functionalized with quaternary ammonium moieties; wherein the quaternary ammonium moieties on the modified carbohydrate polymer include: trimethyl ammonium moieties having formula (I) and dimethyl(alkyl) ammonium moieties having formula (II) wherein each R is independently selected from a C8-22 alkyl group.

Abstract: A silicone-organic copolymer has the formula Xg[ZjYo]c, where each X is an independently selected silicone moiety having a particular structure, each Y is an independently selected polyacrylate moiety, each Z is an independently selected siloxane moiety, subscript c is from 1 to 150, subscript g is >1, 0<j<2, and 0<o<2, with the proviso that j+o=2 in each moiety indicated by subscript c. Methods of preparing the silicone-organic copolymer are also disclosed. Further, a sealant is disclosed, the sealant comprising the silicone-organic copolymer and a condensation-reaction catalyst.

Abstract: The present invention relates to a composition comprising a binder comprising one or more siloxane polymers, silicone resins, silicone based elastomers, and mixtures thereof, wherein said binder optionally comprises one or more cross-linker components comprising a silane and/or a siloxane containing silicon-bonded hydrolysable groups; and a hydrophilic powder and/or gel selected from one or more amorphous, porous hydrophilic silica(s), one or more hydrophilic silica aerogel(s) and mixtures thereof, said amorphous, porous hydrophilic silica and/or said hydrophilic silica aerogel having a BET surface area from 100 m2/g to 1500 m2/g or greater and a thermal conductivity from 0.004 to 0.05 W/m·K at 20° C. and atmospheric pressure. The invention also relates to the use of said composition as or in thermally or acoustically insulating materials and to coatings, products and articles made therefrom.

Abstract: Provided is a polymer particle comprising (a) a core polymer comprising (i) polymerized units of one or more Si-containing monomers; (ii) polymerized units of one or more monovinyl acrylic monomers (ii); and (iii) polymerized units of one or more graftlinkers that have no silicon atoms; (b) a shell polymer comprising polymerized units of one or more acrylic monomers. Also provided is a composition comprising polyvinyl chloride and a plurality of the polyer particles.

Abstract: A polyfunctional organohydrogensiloxane is prepared using a boron containing Lewis acid as catalyst. The polyfunctional organohydrogensiloxane may be formulated into release coating compositions. Alternatively, the polyfunctional organohydrogensiloxane may be further functionalized with a curable group to form a clustered functional organosiloxane. The clustered functional organosiloxane may be formulated into thermal radical cure adhesive compositions.

Abstract: A curable silicone composition is provided. The curable silicone composition is useful for forming a cured product which inhibits the discoloration of silver electrodes or a silver-plated substrate in an optical semiconductor device due to a sulfur-containing gas. The curable silicone composition comprises at least one type of a crown compound. An optical semiconductor device is also provided. The optical semiconductor device has excellent reliability after a sulfur resistance test, in which an optical semiconductor device on silver electrodes or a silver-plated substrate is sealed, covered, or adhered with a cured product of the curable silicone composition.

Abstract: An aqueous dispersion of a silicone pressure sensitive adhesive base can be combined with a curing agent and cured to form a silicone pressure sensitive adhesive. The aqueous dispersion of the silicone pressure sensitive adhesive base includes a bis-hydroxyl-terminated polydiorganosiloxane; a polyorganosilicate resin; cumene; a surfactant; and water. A curing agent such as a peroxide compound or an aminosilane may be combined with the aqueous disperison of the silicone pressure sensitive adhesive base to form a silicone pressure sensitive adhesive composition. A pressure sensitive adhesive article may be formed by a method including coating a surface of a substrate with the silicone pressure sensitive adhesive composition, removing water, and curing the silicon pressure sensitive adhesive composition to form a silicone pressure sensitive adhesive on the surface of the substrate.