Abstract: A process to remove a semiconductor die from a plastic package and then to reassemble the die in a high reliability hermetic package. The process is used to remove an already existing die using a unique disassembly and etching process and make the removed die more reliable by reattaching the die and rebonding all new die wires into either a hermetic package or a different type of package with a “bond-on-top-of-bond” technique. The original bondfoot on the removed die may be first preconditioned by a novel bond-flattening tool, which can be attached to the bond-head chuck of any wirebonder. Also, the die can be used in other applications with different pin-outs or configurations.
Type:
Grant
Filed:
August 23, 2001
Date of Patent:
August 6, 2002
Assignee:
DPA Labs, Incorporated
Inventors:
Philip Young, Douglas Young, Scott McDaniel, Gary Bivins, William S. Ditto, Huong Kim Lam