Abstract: A method of making an absorbent composite that includes a first fabric, a second fabric, and particles positioned between the two fabrics and absorbent articles made from the absorbent composite. The particles are secured between the two fabric using adhesive, thermal plastic or combinations thereof. The fabrics are bonded together in a manner that limits particle movement between the fabrics. The bond pattern may define pockets or other shapes. In applications in which the bond pattern forms pockets, the particles may be positioned in the pockets. The particles may be SAP particles or other particles with advantageous properties.
Type:
Application
Filed:
December 19, 2013
Publication date:
June 26, 2014
Applicant:
DSG TECHNOLOGY HOLDINGS LIMITED
Inventors:
Patrick King Yu Tsang, Kuo-Shu Edward Chang, Andrew C. Wright
Abstract: A method of making an absorbent composite that includes a first fabric, a second fabric, and particles positioned between the two fabrics and absorbent articles made from the absorbent composite. The particles are secured between the two fabric using adhesive, thermal plastic or combinations thereof. The fabrics are bonded together in a manner that limits particle movement between the fabrics. The bond pattern may define pockets or other shapes. In applications in which the bond pattern forms pockets, the particles may be positioned in the pockets. The particles may be SAP particles or other particles with advantageous properties.
Type:
Application
Filed:
March 19, 2012
Publication date:
July 12, 2012
Applicant:
DSG TECHNOLOGY HOLDINGS LIMITED
Inventors:
Patrick Tsang, Kuo-Shu Edward Chang, Andrew Wright
Abstract: A method of making an absorbent composite that includes a first fabric, a second fabric, and particles positioned between the two fabrics and absorbent articles made from the absorbent composite. The particles are secured between the two fabric using adhesive, thermal plastic or combinations thereof. The fabrics are bonded together in a manner that limits particle movement between the fabrics. The bond pattern may define pockets or other shapes. In applications in which the bond pattern forms pockets, the particles may be positioned in the pockets. The particles may be SAP particles or other particles with advantageous properties.
Type:
Grant
Filed:
February 22, 2006
Date of Patent:
April 3, 2012
Assignee:
DSG Technology Holdings Limited
Inventors:
Patrick Tsang, Kuo-Shu Edward Chang, Andrew Wright