Patents Assigned to DuPont-Mitsui Polychemicals Co.
  • Publication number: 20130130001
    Abstract: The purpose of the present invention is to provide a laminate film which has excellent heat resistance and stress relaxing properties and is suitable as a component member for a film that is used for the production of a semiconductor. The present invention relates to a laminate film (10) having a laminated structure composed of at least two layers including the outermost layer (6), wherein the outermost layer (6) comprises a thermoplastic resin composition containing a thermoplastic resin having a melting point of 98° C. or higher, at least one layer (a second layer (3)) other than the outermost layer (6) comprises a resin composition containing an ethylene-(unsaturated carboxylic acid) copolymer having an unsaturated carboxylic acid content of 17 mass % or more or an ionomer of the copolymer.
    Type: Application
    Filed: July 28, 2011
    Publication date: May 23, 2013
    Applicant: DUPONT-MITSUI POLYCHEMICALS CO., LTD
    Inventors: Masataka Aoyama, Atsushi Morimoto, Chikara Ichinoseki, Yoshitaka Hironaka
  • Publication number: 20080234456
    Abstract: The present invention aims at providing a stretched film of an olefin polymer excellent in anti-static property, which is obtained from an olefin polymer composition comprising an olefin polymer and potassium salt of an ethylene-unsaturated carboxylic acid copolymer, and a gist in construction resides in a stretched film of an olefin polymer, which has been obtained from an olefin polymer composition (C) comprising an olefin polymer (A) and potassium salt of an ethylene-unsaturated carboxylic acid copolymer (B) and has been stretched at a stretching factor in terms of plane factor of at least 3 times. Stretching is preferably biaxially stretching and the olefin polymer composition (C) is preferably comprised of 99-60% by weight of the olefin polymer (A) and 1-40% by weight of potassium salt of an ethylene-unsaturated carboxylic acid copolymer (B).
    Type: Application
    Filed: December 20, 2005
    Publication date: September 25, 2008
    Applicant: Dupont-Mitsui Polychemicals Co., Ltd.
    Inventors: Tohru Sawai, Masaru Shimizu, Masanobu Sato
  • Publication number: 20070267059
    Abstract: Encapsulating material for solar cells which facilitates fabricating solar cell modules and has excellent transparency, heat resistance, flexibility, etc., and a solar cell modules. More specifically, the present invention provides encapsulating material for solar cells comprising a non-crystalline or low-crystalline a-olefin-based copolymer or its composition (I). In a preferred embodiment, the aforementioned copolymer or its composition (I) is a resin composition (C) containing 50 to 100 parts by weight of non-crystalline ?-olefin polymer (A) meeting the following requirements: (a) the ?-olefin having 3 to 20 carbon atoms is not less than 20 mol %, (b) practically no melt peak as measured by a differential scanning calorimeter is observed, and (c) the Mw/Mn is not more than 5, and 50 to 0 parts by weight of crystalline ?-olefin polymer (B) (the total of (A) and (B) being 100 parts by weight).
    Type: Application
    Filed: December 27, 2005
    Publication date: November 22, 2007
    Applicants: DuPont-Mitsui Polychemicals Co., Ltd., Mitsui Chemicals Fabro, Inc.
    Inventors: Koichi Nishijima, Akira Yamashita
  • Patent number: 6835269
    Abstract: A laminated film exhibiting excellent interlayer adhesiveness obtained by extrusion-laminating a resin directly on a polyester film without effecting anchor-coating or without treating the molten film of the extrusion-laminated resin with ozone. The laminated film is obtained by extrusion-laminating, onto the polyester film, an ethylene copolymer containing an unsaturated carboxylic acid and a (meth)acrylic acid ester, which may be further blended with a small amount of an ethylene/&agr;-olefin copolymer having a density of 840 to 900 kg/m3, the amount of the unsaturated carboxylic acid component being from 1 to 12% by weight and the amount of the (meth)acrylic acid ester component being from 2 to 25% by weight.
    Type: Grant
    Filed: March 29, 2001
    Date of Patent: December 28, 2004
    Assignee: DuPont-Mitsui Polychemicals Co., Ltd.
    Inventors: Kenji Miharu, Naozumi Suzuki
  • Patent number: 6667358
    Abstract: An olefin-type flame-retardant resin composition having excellent mechanical strength, abrasion resistance and workability, and exhibiting excellent flame-retardant properties and shell-forming properties when it has burned, despite the resin composition is blended with an inorganic compound. The composition contains 25 to 250 parts by weight of (D) a flame-retardant inorganic compound per 100 parts by weight of a base resin composition containing 95 to 5% by weight of (A) a copolymer of an ethylene and a vinyl acetate or other polar group-containing monomer, (B) 5 to 95% by weight of a copolymer of an olefin and an unsaturated carboxylic acid ester or other polar group-containing monomer, and 0 to 49% by weight of (C) a thermoplastic resin other than the above copolymers.
    Type: Grant
    Filed: January 17, 2001
    Date of Patent: December 23, 2003
    Assignee: DuPont-Mitsui Polychemicals Co.
    Inventor: Masataka Aoyama
  • Patent number: 6011115
    Abstract: A thermoplastic resin composition comprising 50 to 85 parts by weight of an ethylene-vinyl alcohol copolymer, 10 to 40 parts by weight of an ionomer of ethylene-unsaturated carboxylic acid copolymer containing about 5 to 12 mole % of unsaturated carboxylic acid, and 1 to 25 parts by weight of a polyamide and a packaging material comprising said resin composition are provided. The resin composition is excellent in gas barrier property, impact resistance, pinhole resistance, stretchability, drawability and transparency and is preferably used for packaging material.
    Type: Grant
    Filed: September 2, 1997
    Date of Patent: January 4, 2000
    Assignee: DuPont-Mitsui Polychemicals Co. Ltd.
    Inventors: Kenji Miharu, Hitoshi Tachino
  • Patent number: 5283100
    Abstract: Disclosed is a molding a molding for mounting a window glass on the window opening of an automotive body, said molding for automobile windows comprising a flexible leg portion, an upper flange portion which extends toward both sides at an upper part of the leg portion and supports the edge portion of the glass, upper lip portions that form both tips of said upper flange portion, and lower lip portion which are adhered to the window opening of the automotive body, wherein at least the upper lip portions and the lower lip portions of said molding are formed by using a thermoplastic olefinic elastomer or a composition of said elastomer and an olefin-ethylene type unsaturated carboxylic acid copolymer or a salt thereof having a hardness in compliance with JIS A of from 50 to 80, said leg portion and said flange portion are formed by using a blend of the thermoplastic olefinic elastomer and the olefin-ethylene type unsaturated carboxylic acid copolymer or a salt thereof, said blend having a hardness in compliance
    Type: Grant
    Filed: June 24, 1992
    Date of Patent: February 1, 1994
    Assignees: Dupont-Mitsui Polychemicals Co., Ltd., Tokiwa Chemical Industry Co., Ltd.
    Inventors: Toshio Yui, Yoshimasa Yamamoto, Naohisa Miyakawa
  • Patent number: 5231133
    Abstract: A thermoplastic polymer which is the reaction product of(A) at least one copolymer selected from the group consisting of ethylene/unsaturated carboxylic acid copolymers and ionically crosslinked products thereof wherein the ion is a zinc, cobalt, nickel, copper, lead or magnesium ion,(B) a polyamine compound having at least two primary and/or secondary amino groups, and(C) a polyepoxy resin in a proportion corresponding to not more than one epoxy group for one amino group of the polyamine compound; and a process for its production.
    Type: Grant
    Filed: June 4, 1991
    Date of Patent: July 27, 1993
    Assignee: Dupont Mitsui Polychemicals Co., Ltd.
    Inventors: Eisaku Hirasawa, Hirohide Hamazaki
  • Patent number: 5210138
    Abstract: Disclosed is an ionomer composition comprising (A) an ionomer formed by neutralizing a carboxyl group of an ethylene/unsaturated carboxylic acid copolymer with an transition metal cation, (B) a polyamide and (C) a polyamide oligomer having a terminal group of the molecule chain blocked with a primary amino group. Since two polyamide components differing in the degree of polymerization are incorporated in this ionomer composition, excellent characteristics of the ionomer resin are related in the ionomer composition, and the mechanical strength at high temperatures, the formability and the transparency are prominently improved.
    Type: Grant
    Filed: February 12, 1991
    Date of Patent: May 11, 1993
    Assignee: Dupont-Mitsui Polychemicals Co., Ltd.
    Inventors: Yoshimasa Yamamoto, Eisaku Hirasawa
  • Patent number: 5179168
    Abstract: Disclosed is an ionomer composition comprising an ethylene/unsaturated carboxylic acid copolymer which is at least partially neutralized with at least one alkali metal selected from the group consisting of potassium, rubidium and cesium, wherein the ethylene/unsaturated carboxylic acid copolymer is a blend comprising (A) an ethylene/unsaturated carboxylic acid copolymer having an unsaturated carboxylic acid content of 6 to 15 mole % and (B) an ethylene/unsaturated carboxylic acid copolymer having an unsaturated carboxylic acid content of 0.5 to 5 mole % at an (A)/(B) weight ratio of from 10/90 to 80/20, and the alkali metal is present in an amount at least 0.4 millimole but smaller than 1.3 millimoles per gram of the ionomer composition.This ionomer composition has an excellent antistatic property and an excellent heat moldability.
    Type: Grant
    Filed: September 21, 1990
    Date of Patent: January 12, 1993
    Assignee: Dupont-Mitsui Polychemicals Co., Ltd.
    Inventor: Eisaku Hirasawa
  • Patent number: 4588855
    Abstract: A semiconducting composition comprising(A) a random copolymer of propylene and an alpha-olefin having at least 4 carbon atoms as main constituents, which contains 50 to 87 mole % of the propylene units,(B) fine particles of carbon black, and as an optional component,(C) at least one random copolymer selected from the group consisting of a random copolymer of ethylene and a vinyl ester having 4 or 5 carbon atoms as main constituents, which contains at least about 5.4 mole % of the vinyl ester units, and a random copolymer of ethylene and an unsaturated carboxylic acid ester having 4 to 8 carbon atoms as main constituents, which contains at least 3 mole % of the unsaturated carboxylic acid ester units.The semiconducting composition or its crosslinked product is useful as an outside semiconducting layer in a power cable composed at least of a central conductor, a crosslinked polyethylene insulating layer surrounding the conductor and an outside semiconducting layer surrounding the insulating layer.
    Type: Grant
    Filed: April 15, 1985
    Date of Patent: May 13, 1986
    Assignee: DuPont-Mitsui Polychemicals Co., Ltd.
    Inventors: Yoshikazu Kutsuwa, Kouji Kitahara, Toshiyuki Ishii