Patents Assigned to Dynaco Corp.
  • Method and apparatus for forming multi-layered circuits using liquid crystalline polymers
    Patent number: 7290326
    Abstract: A method and apparatus for producing high layer count, multi-layer circuits which includes fabricating a fixture having an opening therein for placement within a press. A material stack, particularly a material stack having multiple layers of liquid crystalline polymer, is placed within the opening of the fixture before activating the press to laminate the material stack positioned within the fixture.
    Type: Grant
    Filed: July 22, 2005
    Date of Patent: November 6, 2007
    Assignee: Dynaco Corp.
    Inventor: Steven Lee Dutton