Patents Assigned to E&H. Co., Ltd.
  • Publication number: 20210365157
    Abstract: The present invention relates to a fingerprint sensor-integrated touch screen panel, in which, since an electrode disposed to be parallel to a driving electrode is used as a receiving electrode, a bezel area is formed in an extending direction of the driving electrode, thereby minimizing the bezel area and allowing the number of channels required for fingerprint sensing to be reduced.
    Type: Application
    Filed: May 18, 2021
    Publication date: November 25, 2021
    Applicant: E&H. CO., LTD.
    Inventors: Soo Ho Do, Gap Deuk Song, Sang kyu Kim, Jae Gu Lee, Man Seob Shin
  • Patent number: 9360969
    Abstract: Provided is a method of fabricating a capacitive touch-screen panel. The method includes preparing first and second substrates having first lateral surfaces on which first and second transparent conductive layers for forming first and second transparent electrode pattern units are disposed. Each of the first and second substrates has a screen region and an inactive region. Second lateral surfaces of the first and second substrates are bonded to each other by an interlayer adhesive. First and second metal layers for forming first and second outer electrode interconnections are disposed on exposed surfaces of the first and second transparent conductive layers, respectively.
    Type: Grant
    Filed: September 25, 2009
    Date of Patent: June 7, 2016
    Assignee: E&H. CO., LTD.
    Inventor: Yong Hoon Lee
  • Publication number: 20110099805
    Abstract: Provided is a method of fabricating a capacitive touch-screen panel. The method includes preparing first and second substrates having first lateral surfaces on which first and second transparent conductive layers for forming first and second transparent electrode pattern units are disposed. Each of the first and second substrates has a screen region and an inactive region. Second lateral surfaces of the first and second substrates are bonded to each other by an interlayer adhesive. First and second metal layers for forming first and second outer electrode interconnections are disposed on exposed surfaces of the first and second transparent conductive layers, respectively.
    Type: Application
    Filed: September 25, 2009
    Publication date: May 5, 2011
    Applicant: E&H. Co., Ltd.
    Inventor: Yong Hoon Lee