Patents Assigned to E. I. Engineering Co., Ltd.
  • Patent number: 8396605
    Abstract: A system, for simulating a heat and power supply facility, that is capable of easily constructing a heat and power supply facility, and that performs a simulation so as to approximate operating conditions including a load factor to an actual situation, by approximating, to a high accuracy, any item included in a total combined energy to a target value.
    Type: Grant
    Filed: April 17, 2009
    Date of Patent: March 12, 2013
    Assignee: E. I. Engineering Co., Ltd.
    Inventors: Teruhiko Ogawa, Satoshi Shimizu, Toshiko Kurata
  • Publication number: 20110035069
    Abstract: There is provided a system, for simulating a heat and power supply facility, that is capable of easily constructing a heat and power supply facility, and that performs a simulation so as to approximate operating conditions including a load factor to an actual situation, by approximating, to a high accuracy, any item included in a total combined energy to a target value. A system configuration setting section (30) associates in advance the heat and power supply devices with each other and associates in advance the heat and power supply devices with the total combined energy, and selects any of the heat and power supply devices with an operation of an operating condition section, to thereby freely construct a system configuration of the heat and power supply facility in which the heat and power supply devices are associated with each other and the heat and power supply devices are associated with the total combined energy.
    Type: Application
    Filed: April 17, 2009
    Publication date: February 10, 2011
    Applicant: E. I. Engineering Co., Ltd.
    Inventors: Teruhiko Ogawa, Satoshi Shimizu, Toshiko Kurata