Abstract: An apparatus for thermoset molding includes a first mold portion having a first rim and a second mold portion, having a second rim which substantially conforms to the first rim. The first and second mold portions form a mold cavity therebetween. An actuator mechanism is coupled to the first and second mold portions and is adapted to selectively press the first and second mold portions together. An inner seal positioned between the first and second rims and generally conforming to the first and second rims is provided to substantially seal the first and second rims when pressed together. A bridging member spans the inner seal and selectively weakens the inner seal thereby allowing air passage therepast. An injection valve is provided having a plunger which is moveable to allow resin injection or resin blow-through. Further, a mount is provided for removably attaching a clamp to a mold portion.