Abstract: A cutting segment for a cutting tool used for cutting or drilling brittle workpieces, such as stone, brick, concrete and asphalt, a method for manufacturing the segment, and a cutting tool comprising the segment are disclosed. The segment comprises layers of diamond particles and two kinds of plate-shaped metal matrix layers comprising soft and hard metal matrix layers having different ductility. The plate-shaped metal matrix layers are arranged perpendicular to a cutting surface while being parallel to a cutting direction, and are alternately stacked perpendicular to the cutting direction. The layers of diamond particles are suitably arranged in the plate-shaped soft and hard metal matrix layers. The segment and the cutting tool comprising the same have excellent cutting ability, and the manufacturing process thereof can be simplified, thereby remarkably enhancing productivity.
Type:
Application
Filed:
April 13, 2006
Publication date:
March 15, 2007
Applicants:
GENERAL TOOL, INC., EHWA DIAMOND INDUSTRIAL CO., LTD
Abstract: A cutting segment for a cutting tool used for cutting or drilling a brittle workpiece, such as stone, brick, concrete and asphalt, a method of manufacturing the segment and a cutting tool provided with the segment are disclosed. The segment comprises a plurality of plate-shaped metal matrix layers laminated perpendicular to a cutting surface of the segment while being parallel to a cutting direction of the segment, the plate-shaped metal matrix layers being integrally combined with each other and made of a ferrous or non-ferrous material; and diamond particle layers arranged between the plate-shaped metal matrix layers such that diamond particles can be provided in an array on the cutting surface. The segment has an excellent cutting capability, and can be made by a simplified manufacturing process, thereby remarkably reducing manufacturing costs.
Type:
Grant
Filed:
December 9, 2004
Date of Patent:
November 14, 2006
Assignees:
Ehwa Diamond Industrial Co. Ltd., General Tool, Inc.
Abstract: A cutting segment for a cutting tool used for cutting or drilling a brittle workpiece, such as stone, brick, concrete and asphalt, a method of manufacturing the segment and a cutting tool provided with the segment are disclosed. The segment comprises a plurality of plate-shaped metal matrix layers laminated perpendicular to a cutting surface of the segment while being parallel to a cutting direction of the segment, the plate-shaped metal matrix layers being integrally combined with each other and made of a ferrous or non-ferrous material; and diamond particle layers arranged between the plate-shaped metal matrix layers such that diamond particles can be provided in an array on the cutting surface. The segment has an excellent cutting capability, and can be made by a simplified manufacturing process, thereby remarkably reducing manufacturing costs.
Type:
Application
Filed:
December 9, 2004
Publication date:
October 27, 2005
Applicants:
General Tool, Inc., EHWA DIAMOND INDUSTRIAL CO., LTD.
Abstract: A saw blade for cutting hard workpieces, such as concrete or stone, characterized by improvement of the shape of a shank of the saw blade providing a plurality of cutting tips of the saw blade with a rotational force while the cutting tips are securely attached to the shank. The saw blade comprises a disc-shaped shank having an insertion hole formed at the center thereof, through which a rotating shaft of an electric-powered tool is inserted, and wave-shaped portions formed over a prescribed portion of the radius of the disc-shaped shank, and a plurality of cutting tips attached to the outer circumference of the shank for cutting a workpiece. The wave-shaped portions are spaced a prescribed distance from each other and alternately arranged on the front and rear surfaces of the disc-shaped shank. The prescribed portion of the radius of the disc-shaped shank is at a distance from the center of the insertion hole. The cutting tips contain particles of high hardness.
Type:
Grant
Filed:
July 24, 2003
Date of Patent:
March 29, 2005
Assignee:
Ehwa Diamond Industrial Co., Ltd.
Inventors:
Seung Weon Lee, Yong Hyun Park, Jong Suk Choi, Eui Seok Jung
Abstract: A saw blade for cutting hard workpieces, such as concrete or stone, characterized by improvement of the shape of a shank of the saw blade providing a plurality of cutting tips of the saw blade with a rotational force while the cutting tips are securely attached to the shank. The saw blade comprises a disc-shaped shank having an insertion hole formed at the center thereof, through which a rotating shaft of an electric powered tool is inserted, and wave-shaped portions formed over a prescribed portion of the radius of the disc-shaped shank, and a plurality of cutting tips attached to the outer circumference of the shank for cutting a workpiece. The wave-shaped portions are spaced a prescribed distance from each other and alternately arranged on the front and rear surfaces of the disc-shaped shank. The prescribed portion of the radius of the disc-shaped shank is at a distance from the center of the insertion hole. The cutting tips contain particles of high hardness.
Type:
Application
Filed:
July 24, 2003
Publication date:
December 2, 2004
Applicant:
EHWA DIAMOND INDUSTRIAL CO., LTD.
Inventors:
Seung Weon Lee, Yong Hyun Park, Jong Suk Choi, Eui Seok Jung
Abstract: A segment type diamond tool, used for cutting or drilling brittle substances, such as stones, bricks, concrete structures, or asphalt structures, is disclosed. In the diamond tool, the segments are each set with diamonds in a single-layered structure or a multi-layered structure, and are alternately or intermittently arranged on a steel core, different from conventional diamond tools having segments randomly set with diamonds. Such a diamond arrangement of this invention allows the diamonds to more effectively perform their cutting action, and so the diamond tool has an increased cutting rate, in addition to reducing the amount of fine debris generated during a cutting or drilling process to ill-affect worker's health or cause environmental pollution.
Type:
Grant
Filed:
November 20, 2001
Date of Patent:
September 30, 2003
Assignees:
Ehwa Diamond Industrial Co., Ltd., General Tool, Inc.
Inventors:
Soo Kwang Kim, So Young Yoon, Jong Ho Kim