Abstract: A transport mechanism for printed circuit boards is comprised of two endless drive members, movable carriers installed between these two drive members and one pair of parallel guide rails to support the carriers while moving in a horizontal state. The drive members extend diagonally between horizontal upper and lower runs on both ends of the mechanism. The carriers are installed at fixed intervals along the length of the drive members. The carriers are also provided with a roller member on both sides of the carrier to run on the upper part of the guide rail. The guide rail is further installed diagonally along the diagonal portion of the drive members at fixed intervals in order to support the carrier horizontally while in a diagonal state of movement.

Abstract: An automatic soldering apparatus for soldering a printed circuit board having a plurality of electronic parts mounted thereon to be soldered while it is transported through a heating chamber having an inert gas fill therein is provided. The apparatus has a first station provided with a first opening for receiving the printed circuit board into the heating chamber and a second station provided with a second opening for removing the soldered printed circuit board from the heating chamber. Further, the apparatus has a supply of an inert gas and nozzles provided in the first and second stations. The inert gas is jetted through the nozzles toward the first and second openings, when required, so as to prevent outside air from flowing into the heating chamber.

Abstract: An automatic soldering apparatus for soldering a printed circuit board includes a plurality of electronic elements mounted thereon to be soldered thereto.

Abstract: An automatic reflow soldering apparatus for soldering a printed circuit board having a plurality of electronic elements mounted thereon to be soldered while the printed circuit is heated, wherein transporting means transports a carrier carrying the printed circuit board to be soldered, positioning means arranged on the carrier position the printed circuit board on the carrier and support means arranged on the carrier support the printed circuit board to prevent the latter from being warped when heated to be soldered. The printed circuit board is transported through all of the soldering processes from a heating process to a cooling process while the printed circuit board is thus positioned and supported. Further provided is means which is automatically operated to position and support the printed circuit board on the carrier.