Patents Assigned to EKO Instruments Trading Co., Ltd.
  • Patent number: 6991366
    Abstract: A method of measuring the heat conductivity of an object to be measured, comprising generating heat between the object to be measured and a heat resistant material, causing heat to flow through the interior of the object to be measured and the interior of the heat resistant material and obtaining the heat conductivity of the object to be measured from a temperature difference between at least two points of the heat resistant material, a heat conductivity measuring instrument using the same and a method of producing a heat insulating material.
    Type: Grant
    Filed: October 23, 2001
    Date of Patent: January 31, 2006
    Assignees: Nisshinbo Industries, Inc., EKO Instruments Trading Co., Ltd.
    Inventors: Reishi Naka, Masato Hayashi, Tomohiro Koyama, Toshikazu Hasegawa, Takeshi Aoshima
  • Patent number: 4719344
    Abstract: A method for measuring the amount of direct solar radiation and an apparatus according to the method. The invention provides a light sensor which rotates at a constant speed while scanning the sky including the sun. The differential coefficient of the radiation received is obtained from the output of the light-receiving element, thus substantially eliminating the scattered light component from the output. The preferred embodiment of the light-receiving element is a pyroelectric detector.
    Type: Grant
    Filed: August 21, 1986
    Date of Patent: January 12, 1988
    Assignee: Eko Instruments Trading Co., Ltd.
    Inventor: Tozawa Hiroyuki
  • Patent number: 4343960
    Abstract: An improved thermopile is provided. A plurality of thermocouples constituting the thermopile are composed of segments of one metal and segments of the other metal, and the segments of different metals are connected to one another alternately so that the thermocouples are arranged in series on a heat-resistant, electrically non-conductive substrate. Each segment has a portion plated on one surface of the substrate, a portion plated on the other surface of the substrate and a portion plated on the inner wall of through holes formed in the substrate to connect the two portions plated on the two surfaces of the substrate with each other. The thermopile is prepared advantageously by utilizing plating and photo-etching techniques.
    Type: Grant
    Filed: November 12, 1980
    Date of Patent: August 10, 1982
    Assignees: Building Research Institute, Ministry of Construction, Ryoko Electronic Industries Ltd., Eko Instruments Trading Co., Ltd.
    Inventors: Kazuo Eguchi, Tadashi Kobayashi, Yukiharu Miyake