Abstract: A liquid cooling system is disclosed herein. The liquid cooling system contains one or more elements or components which provide for liquid cooling of heated or electronic environments, requiring heat dissipation. The liquid cooling system provides for creating a single looped assembly, which provides for a single-block system to cool all heat-producing components in an environment, which eliminates required fittings to complete the liquid cooling loop.

Abstract: A method for manufacturing a fluid-based cooling element is provided. The fluid-based cooling element is configured for cooling a heat generating element arranged on a printed circuit board (100). The method comprises forming a base body comprising a plate-shaped base body portion and an inner base body portion integrally formed with the plate-shaped base body portion. The step of forming the base body comprises forming the plate-shaped base body portion and the inner base body portion by means of die casting. The inner base body portion comprises a plurality of protrusions formed on an upper side of the inner base body portion. The protrusions have a gap size in a range of 0.5 mm to 1.5 mm.

Abstract: A cooling liquid composition for a liquid cooling system for cooling a heat generating element arranged on a printed circuit board (PCB) comprises an aqueous solution comprising a copolymer having a copolymer concentration in a range of 0.05% to 20% by mass.