Abstract: A solderable electrically conductive composition includes metallic silver particles embedded in a matrix formed from acrylic, carboxylated vinyl and epoxy. The composition is formed by dissolving acrylic powder and vinyl powder in respective solvents to form a first solution and a second solution. The solutions are then mixed with metallic silver particles and an epoxy to form an ink which is applied to a substrate to form a film thereon. The film is cured to evaporate the solvents and allow polymerization to occur thereby leaving a solderable electrically conductive film, formed from metallic silver particles embedded in a matrix containing acrylic, vinyl and epoxy, on the substrate.

Abstract: A solderable electrically conductive composition includes metallic silver particles embedded in a matrix of carboxylated vinyl and epoxy. The composition is formed by dissolving the vinyl in a solvent to form a solution. The solution is then mixed with the metallic silver particles and the epoxy to form an ink which is applied to a substrate to form a film thereon. The film is cured to evaporate the solvent and allow polymerization to occur thereby leaving a solderable electrically conductive film, formed from metallic silver particles embedded in a matrix of vinyl and epoxy, on the substrate.

Abstract: A blister-resistant thick film dielectric is usable with multilayer circuits having one conductor layer comprising gold and another conductor layer comprising silver to prevent blistering and other unwanted phenomena resulting from an adverse electrochemical reaction from occurring between the conductor layers during the firing process. The dielectric is comprised be weight, without vehicle, of about 50% lead-boro-silicate glass, between about 25% to about 40% Al.sub.2 O.sub.3 and between about 10% to 25% an oxide mixture comprised of Co.sub.2 O.sub.3, Cr.sub.2 O.sub.3 Fe.sub.2 O.sub.3, said oxide mixture having been heated to about 1000.degree. C. for about 24 hours. In a preferred embodiment the dielectric is comprised by weight, without vehicle, of about 50% lead-boro-silicate, about 40% Al.sub.2 O.sub.3 and about 10% oxide mixture. The oxide mixture in a preferred embodiment is comprised by weight of about 37.4% Co.sub.2 O.sub.3, about 25.6% Cr.sub.2 O.sub.3 and about 37.0% Fe.sub.2 O.sub.3.

Abstract: In a microelectronic package of the type where Si-based integrated circuits are eutectically attached to a Pd/Au-based thick film conductor, a method of reducing the potential for thermal runaway is taught. The method involves increasing the surface area of the Pd to lower the Vbe rating. This reduces the potential for thermal runaway in subsequent integrated circuit operation. It has also been found that increasing the particle size of the Au component further decreases the Vbe rating.

Abstract: A film type resistor especially suitable for use on planar electronic circuit substrates. The resistor is capable of being adjusted or trimmed to provide resistance values over a substantially wide range. The resistor can also be trimmed while actively functioning in a circuit including one or more other components, so as to provide a desired operating parameter for the circuit.