Abstract: Two opposing hollow non-turbulent solder waves are provided which project inwards and solder is collected in a containment area. The two solder waves can have different flows and pressures, the first solder wave flooding the underside of a circuit board or other item and the second solder wave reducing a build up of solder. The soldering apparatus has a solder tank with a conveyor to convey items to a first solder wave and to a second solder wave. A solder containment area is provided between the two solder waves which receives solder from the solder waves and feeds the solder back into the solder tank.