Abstract: Printed circuit boards, assemblies and the like are heated uniformly from edge to edge or to a desired lateral temperature profile while being conveyed through a heating area. The conveying systems reliably conveys circuit boards and the like through the heating area without dropping them. A rail heater is provided to heat rails supporting conveyors having pins to hold circuit boards and the like. A control for the rail heaters controls the temperature of the rails so the circuit boards are positively supported on the conveyors and have a uniform temperature profile or desired temperature profile from edge to edge.

Abstract: A solder wave nozzle construction allows components to be disassembled for cleaning and removing dross from a solder reservoir. The quick connection joints allow downtime for cleaning a solder wave machine to be greatly reduced. In one embodiment a solder nozzle duct fits over a chimney flow duct and has quick release clips on each side. In another embodiment, a quick release back plate, front plate, exit trough, dross reduction tray and front gate are all easily removable. In a further embodiment a solder nozzle duct fits within a chimney flow duct, and has an adjustable height so it can be positioned for optimum solder wave height.

Abstract: An improved method and apparatus restricts or limits dross formation in a soldering apparatus where liquid solder overflows such as wave soldering and the like. The improvement comprises a solder receiving tray positioned beneath at least a portion of liquid solder falling from an overflow or solder wave to a reservoir and a level control means limits the maximum solder level in the tray above a dynamic solder level in the reservoir, the solder level in the tray being a predetermined distance below the overflow to limit dross formation thus restricting dross recirculation.

Abstract: A foam fluxer for fluxing surface mounted devices on printed wiring boards is suitable for low solids content fluxes. The foam fluxer is for installation in an open tank containing liquid flux positioned under a conveyor path conveying the components. The fluxer comprises an aerator chimney housing with side walls and end walls for placement in and protruding above the open tank, the housing having a top foam outlet for positioning below the conveyor path, at least one vertical internal divider located in the housing below the foam outlet, the divider forming at least two chambers, and a porous aerator tube located in each chamber with connection means for a compressed gas supply to produce foam in each chamber, the foam from each chamber joining above the divider to exit upwards from the foam outlet.

Abstract: A multi stage heater heats items on a conveyor so that they follow a predetermined temperature profile. The heater is used for printed circuit boards or the like when heated for soldering and avoids thermal gradients that can occur with heating different materials. The heater has a first heater for applying a first quantity of heat to items on the conveyor, a temperature sensing device for determining temperature of items leaving the first heater, a second heater downstream of the first heater and a control system which compares signals from the temperature sensing device with a predetermined temperataure profile to produce a first control output to control the first heater and a second control output to control the second heater so that items passing through the heater follow the predetermined temperature profile.

Abstract: Wave soldering process and apparatus for the soldering of elements such as, for example, printed circuit assemblies with surface mounted components and the like which yield improved soldering results by promoting the penetration of solder into narrow spaces between components, the filling of small holes in a board, filling crevices, filling corners adjacent to solder masks and all other areas where solder wetting is difficult to achieve with conventional machines. The process provides the steps of moving an element in a predetermined path, forming a solder wave beneath the path so that at least a portion of the element passes through the solder wave, and producing an oscillation in the solder wave during the passage of the element therethrough.

Abstract: A pallet for holding electronic components or circuit boards for solder coating, soldering or tinning in a soldering machine has a light weight unit which is quick, easy and simple to use. The pallet can be operated in small loading areas and is self contained not requiring easy to lose components. The pallet includes a frame with recesses for locating electronic components or circuit boards, at least one slide bar extending across the frame which has clamp members attached thereto for clamping the electronic components or circuit boards in the recesses, and toggle clamps connected to the slide bar for clamping and unclamping the electronic components or circuit boards with the clamp members, and for moving the clamping members aside from the recesses when not clamped to permit electronic components or circuit boards to be removed and replaced.