Abstract: An apparatus and method for cleaning solder paste from stencils, screens, misprinted circuit boards, and tools associated with the manufacturing of surface mount technology circuit boards. The apparatus includes a holder assembly for holding the solder-laden objects during cleaning and rotatable spray arms connected with a chemical pump for spraying a transversely directed, cyclic waves of solvent onto the object's surfaces. The cleaning action of the spray arms permits use of the solvent at or below room temperature thereby substantially reducing evaporative loss of solvent, environmental injury resulting from such evaporative loss, and exposure of workers to solvent vapors. The apparatus includes filters for filtering heavy metal particles washed from the objects to contain the heavy metals for safe disposal. Safety mechanisms are included in the apparatus to prevent worker injury.