Abstract: An apparatus for and a method of controlled feed of a bonding wire, specifically a golden bonding wire, to the wedge or the capillary tube of a bonding head arranged for upward and downward movement. The apparatus is characterized by a bonding-wire guide duct ahead of the bonding capillary tube, with a fluid pipe opening into this duct which is suited for optional communication with a source of gas blast, specifically air blast, or a vacuum source, and is preferably also characterized by a bonding-wire slip clamp which is effective or closed either permanently or only when the bonding head is lowered for touch-down, and which is disposed particularly ahead of or at the capillary-facing end of the guide duct.

Abstract: A ball bonding method and apparatus is disclosed including gold wire bonding. The steps include positioning and lowering a bond capillary (10) with a bond wire (11) including a flame-scarfed bond wire ball (12) downwardly onto a first bonding pad (17). The bond wire ball (12) is welded by heating and applying a bonding pressure or ultrasonic, or both. The bond capillary (10) is raised and moved to form a loop (21), followed by the step of welding the bond wire (11) to a second bonding pad (16) using heating and applying pressure, ultrasonic or both. The bond capillary (10) is raised to a tail-length position (29) and the bond wire (11) is broken by a vertical pulling force created by closing a clamp (13) onto the wire and raising the clamp (13) engaging the bond wire (11). The end of the free bond wire is flame-scarfed to form a bond wire ball (12).