Abstract: The invention relates to a polyamide moulding compound consisting of the following components: (A) 35-68 wt. % of at least one semi-crystalline, semi-aromatic, thermoplastic polyamide based on aliphatic diamines with 4-8 carbon atoms with a melting temperature of at least 270° C.; (B) 15-22 wt. % carbon fibres; (C) 18-30 wt. % glass fibres; (D) 1-10 wt. % of an impact-resistance modifier that is different from (E) and/or polymers that are different from (A), (E) and (F); (E) 0-10 wt. % ethylene-vinyl acetate copolymer; and (F) 0-3 wt. % additives. In this way, the sum of the components (A)-(F) is 100 wt. %, the sum of the components (B)-(C) is in the range of 33-48 wt. %, and the sum of the components (D)-(E) is in the range of 2-12 wt. %. The moulding compound permits the production of dimensionally stable, electrically conductive components, e.g. for the automotive sector and for contact with fuels, in particular methanol-containing petrol.

Abstract: The present invention relates to a polyamide molding compound which contains the following components (A) to (C) or consist of these components: (A) 50 to 98% by weight of at least one specific amorphous or microcrystalline copolyamide constituted by the specific monomers (a1) to (a4); (B) 2 to 40% by weight of at least one semi-crystalline polyamide which is selected from the group consisting of PA 612, PA 6/12, PA 516, PA 614, PA 616, PA 618, PA 1012, PA 1014, PA 1016, PA 1018 and mixtures thereof; and (C) 0 to 20% by weight of at least one additive; the constituent amounts of the components (A) to (C) adding up to 100% by weight. The invention also relates to molded articles made of said polyamide molding compound and the use thereof.

Abstract: A plastics line (1) is described with at least one layer (5) consisting of the following components: (A) 70-94 weight percent of a polyamide selected from the following group: polyamide 516, polyamide 616, polyamide 1016 or mixtures thereof; (B) 4-20 weight percent impact modifier; (C) 2-15 weight percent of plasticiser; (D) 0-5 weight percent of additives different from (B) and (C), wherein the sum of (A)-(D) is 100 weight percent, and with the proviso that layer (5) does not contain polyamide 6, as well as a method of manufacturing such a plastic pipe and uses of such a plastic pipe.

Abstract: Disclosed are polyamide moulding compounds having a relative permittivity of no more than 3.5 at 2.45 GHz, and having the following components: (A) 25 to 80% by weight of a mixture made of at least one partially crystalline aliphatic polyamide and at least one amorphous or microcrystalline polyamide, (B) 20 to 65% by weight of at least one glass filler, and (C) 0 to 10% by weight of additives, the sum of components (A), (B) and (C) producing 100% by weight. The polyamide moulding compounds are for use in components of devices such as laptops and mobile phones.

Abstract: Plastics line consisting of three layers, an inner layer (3) bordering the interior (2), a middle layer (4) directly adjoining the inner layer (3), and an outer layer (5) directly adjoining the middle layer (4), where the inner layer (3) is formed on the basis of a mixture of at least two polyamides selected from the following group: PA12, PA612, PA616, or consists substantially thereof, the middle layer (4) is formed on the basis of PA612 and/or PA616 or consists substantially thereof, the outer layer (5) is formed on the basis of a mixture of at least two polyamides selected from the following group: PA12, PA612, PA616, or consists substantially thereof.

Abstract: The present invention relates to polyamide moulding compounds that contain a semi-crystalline copolyamide, at least one filler, and optionally additives. The invention likewise relates to mouldings manufacture from these moulding compounds and to the use of the moulding compounds to manufacture mouldings.

Abstract: The present invention relates to semi-crystalline copolyamides and to moulding compounds manufactured from same that contain at least one filler, and optionally additives in addition to the semi-crystalline copolyamide. The invention equally relates to mouldings manufactured from same.

Abstract: The present invention relates to polyamide molding compounds which contain the following components (A) to (C) or consist of these components: (A) 50 to 98% by weight of at least one amorphous or microcrystalline specific polyamide; (B) 2 to 40% by weight of at least one semi-crystalline polyamide which is selected from the group consisting of PA 616, PA 516, PA 1016 and mixtures thereof; and (C) 0 to 16% by weight of at least one additive; the constituent amounts of the components (A) to (C) adding up to 100% by weight. The present invention also relates to molded articles made of these polyamide molding compounds and the use thereof.

Abstract: The invention relates to polyamide moulding compounds containing the following components (A) to (D) or consisting of these components: (A) between 50 and 98 wt. % of at least one polyamide selected from the group consisting of PA 516, PA 616, PA 1016 and mixtures thereof; (B) between 0 and 30 wt. % of at least one polyamide selected from the group consisting of PA 11, PA 12, PA 416, PA 516, PA 69, PA 610, PA 612, PA 614, PA 616, PA 618, PA 816, PA 1010, PA 1012, PA 1014, PA 1016, PA 1018, PA 1212, PA 1216, PA 1218 and mixtures thereof; (C) between 2 and 25 wt. % of at least one specific impact modifier; and (D) between 0 and 20 wt. % of at least one additive; the sum of the constituent amounts of the components (A) to (D) amounting to 100 wt. %.

Abstract: The invention relates to the use of thermoplastic polyamide molding compounds to reduce the formation of solid deposits and/or coatings on tools used in thermoplastic shaping to form useful objects in discontinuous processes, in particular in injection molding, and used in continuous processes such as extrusion to form films, fibers, tubes and casings. The molding compounds used are based on polyamides which are largely based on the polyamide units (616, 516) or (916). By virtue of the use of the polyamide molding compounds according to the invention, the solid deposits and/or coatings that otherwise commonly occur in the further processing of polyamide (12) during injection molding or during extrusion, are greatly reduced or prevented.

Abstract: The invention relates to a method for storage and for transport of polyamide granulate which comprises at least one amorphous or microcrystalline polyamide. By means of this novel method, yellowing during further processing to form the moulded article can be avoided or at least reduced. Likewise, the invention relates to a corresponding container in which the polyamide granulate is stored. The invention also relates to correspondingly stored or transported polyamide granulate and also moulded articles produced therefrom.

Abstract: Disclosed is a polyamide moulding compound formed from a mixture of partially crystalline, aliphatic polyamides and partially crystalline, partially aromatic polyamides and also fibrous reinforcing materials. The partially crystalline, partially aromatic polyamides are thereby formed from a diamine component, a dicarboxylic acid component and possibly a lactam- and/or ?-amino acid component. The mixture and/or the moulding compound can include further components. Moulded articles produced from these moulding compounds are used, for example, in the automobile sphere, in the household sphere, in measuring, regulating and control technology or in mechanical engineering.

Abstract: The present invention relates to polyketone molding compounds based on partially crystalline, aliphatic polyketones. In particular, it relates to halogen-free, flameproof molding compounds based on aliphatic polyketones which preferably comprise salts of phosphinic acids as flame retardant. The molding compounds fulfill the fire protection classification V0 according to UL94 and display good mechanical properties. These molding compounds are suitable for the production of in particular thin-walled molded articles for the electrical and electronics industry, such as for example housings, housing components or connectors.

Abstract: A multi-layer composite in the form of a hollow body enclosing an interior space (2) is proposed, consisting of three or four layers: an inner layer (3) adjoining the interior space (2), a middle layer (4) adjoining the latter and an outer layer (5) adjoining the middle layer (4) and closing the multi-layer composite (1) to the outside. If necessary, there is a further innermost layer (8) which directly adjoins the said inner layer (3) and is equipped with a conductive finish. The inner layer (3) is based on polyamide 6, the middle layer (4) is based on EVOH, and the outer layer (5) is based on a mixture of (A) polyamide 6 and (B) at least one other polyamide selected from the following group: polyamide 612, polyamide 614, polyamide 616 and polyamide 618.

Abstract: Disclosed are polyamide moulding compounds having a relative permittivity of no more than 3.5 at 2.45 GHz, and having the following components: (A) 25 to 80% by weight of a mixture made of at least one partially crystalline aliphatic polyamide and at least one amorphous or microcrystalline polyamide, (B) 20 to 65% by weight of at least one glass filler, and (C) 0 to 10% by weight of additives, the sum of components (A), (B) and (C) producing 100% by weight. The polyamide moulding compounds are for use in components of devices such as laptops and mobile phones.

Abstract: The invention relates to a method for the production of a moulded article, reinforced with at least one reinforcing element, by means of injection moulding. The reinforcing element is hereby connected integrally to the injection mould wall so that, with subsequent injection moulding of the polymer matrix, the reinforcing element is fixed in the mould. The invention relates likewise to a reinforced moulded article which is producible according to this method. The moulded articles according to the invention are used in the production of automobile parts, industrial and consumer goods and also sports appliances.

Abstract: The present invention relates to polyamide molding compounds that are characterized by high notch impact resistance and high gloss. These polyamide molding compounds comprise the following components or consist of these components: (A) 84.5 to 97.0 wt % of at least one amorphous or microcrystalline copolyamide selected from the group comprising PA 6I/6T/MACMI/MACMT/PACMI/PACMT/Y, PA 6I/6T/MACMI/MACMT/Y, and mixtures thereof; (B) 3.0 to 9.5 wt % of at least one specific functionalized impact resistance modifier; and (C) 0 to 6 wt % of at least one additive; wherein the weight proportions of the components (A) to (C) add up to 100 wt %. The present invention furthermore relates to molded bodies composed of this polyamide molding compound.

Abstract: Polyamide moulding composition consisting of the following components (A) 28.0-64.9 wt % of at least one polyamide, (B) 15.0-40.0 wt % of glass fibres, (C) 15.0-35.0 wt % of glass flakes having a particle thickness in the range of 0.3-2.0 ?m, (D) 0.1-2.0 wt % of heat stabilizer, (E) 0-5.0 wt % of additives with the proviso that the sum of components (B) and (C) is in the range of 35.0 to 65.0 wt %, based on the sum of components (A) to (E), and the sum of components (A) to (E) makes 100 wt %.

Abstract: The present invention relates to a polyamide molding compound comprising the following components or consisting of these components: (A) 50 to 95 wt % of a mixture comprising the specific polyamides (A1) and (A2); (B) 5 to 50 wt % of at least one glass filler having a refractive index in the range from 1.540 to 1.600; (C) 0 to 10 wt % of at least one additive; wherein the weight proportions of the components (A) to (C) add up to 100% by weight; wherein the content of (A1) in the mixture (A) is >50 wt %, if the ratio is ?2/?1>1 and the content of (A2) in the mixture (A) is >50 wt %, if the ratio is ?2/?1?1, where ?1=n(A1)?n(B) applies and ?2=n(B)?n(A2) applies; wherein the transparent polyamides (A1) and (A2) have a transparency of at least 90% and a haze of at most 3%; and wherein the mixture (A) has a transparency of at least 88% and a haze of at most 5%. The present invention additionally relates to molded bodies composed of these polyamide molding compounds.

Abstract: The present invention relates to a polyamide molding compound comprising the following components or consisting of these components: (A) 50 to 95 wt % of a mixture comprising the specific polyamides (A1) and (A2); (B) 5 to 50 wt % of at least one glass filler having a refractive index in the range from 1.510 to 1.539; (C) 0 to 10 wt % of at least one additive; wherein the weight proportions of the components (A) to (C) add up to 100% by weight; wherein the content of (A1) in the mixture (A) is >50 wt %, if the ratio is ?2/?1>1 and the content of (A2) in the mixture (A) is >50 wt %, if the ratio is ?2/?1?1, where ?1=n(A1)?n(B) applies and ?2=n(B)?n(A2) applies; wherein the transparent polyamides (A1) and (A2) have a transparency of at least 90% and a haze of at most 3%; and wherein the mixture (A) has a transparency of at least 88% and a haze of at most 5%. The present invention furthermore relates to molded bodies composed of these polyamide molding compounds.