Abstract: The invention features an optical chip having optical functions in large mode size waveguides. Under one aspect of the invention, the optical chip features one or more large mode field size waveguides, one or more low minimum bending radius waveguides to interconnect the large mode field size waveguides, and one or more optical functions integrated within or connected to the large mode field size waveguides.

Abstract: A method for testing an optical chip, while the optical chip is still on a wafer, utilizing an optical probe, includes the steps of creating an access point on the wafer adjacent the optical chip. The optical chip having a waveguide having an axis. A portion of the waveguide is removed to form the access point such that light exiting the planar optical waveguide is directed in a direction substantially different from the axis of the waveguide. An optical probe is placed along a propagation path of the exiting light to optically couple the optical probe and optical chip.

Abstract: A method for testing an optical chip, while the optical chip is still on a wafer, utilizing an optical probe, includes the steps of creating an access point on the wafer adjacent the optical chip. Inserting a probe at the access point to optically couple the optical probe and optical chip. The optical probe includes at least a first optical waveguide for changing the direction of input light at the probe to optically couple with the optical chip at the access point.