Abstract: Nano-particle materials including nanometer-scaled particles with a variety of sizes, chemical compositions, and properties may be used to form functional and/or protective media (layers) on a variety of materials and items. Among the items that may be coated and/or protected by nano-particle materials are integrated circuits, printed circuit boards, micro-electro-mechanical systems (MEMS), photonics devices and packages, optical fibers, and displays, as well as various macroscopic structures, such as pipes (tubes), bridges, towers and other civil engineering structures, all kinds of marine vehicles and off-shore structures, aircraft and aerospace structures, cars, etc.
Type:
Grant
Filed:
June 13, 2003
Date of Patent:
January 22, 2008
Assignee:
ERS Company
Inventors:
Dov Ingman, Vladimir Ogenko, Ephraim Suhir, Andrew Glista
Abstract: A compliant bonding material includes a thixotropic filler, and a plurality of nanoparticles embedded in the filler. The filler can be for example, oil or other stable viscous liquid with the proper surface tension properties, for example, siloxane, other silicone oils, or polysiloxane. The nanoparticles can be, e.g., Ag, Cu, Ti, Ni, metal oxides, silica, ZnO and Fe2O3. A plurality of microspheres can be embedded in the filler, with whiskers formed on surfaces of the microspheres. Nanoparticles can also be embedded in the filler. The whiskers can be nanotubes, nanoparticles and/or nanowires. The whiskers can be, for example, metallic. The bonding material can be used a bonded structure that includes a first surface and a second surface, with the bonding material positioned between the first and second surfaces.