Abstract: A device for desoldering electronic components from circuit boards has a soldering nozzle which produces a solder wave that is directed from below the circuit board against the component to be desoldered; thereby dissolving previous solder bonds. The component can then be lifted out from above and suction is applied from below to the now-opened bores of the circuit board, to remove residual solder from them. A new component can then be installed, using the same equipment.
Type:
Grant
Filed:
September 14, 1981
Date of Patent:
November 1, 1983
Assignee:
Ersa Ernst Sachs GmbH & Co. KG
Inventors:
Gottfried Fuchs, Ewald Garrecht, Lothar Rieck, Wolfgang Ruppel, Rudolf Schwarz, Erich Siegle