Abstract: A transceiver system compensates for baseline wandering in an analog signal in the analog stage before sampling the analog signal and processing the analog signal in the digital stage. The transceiver system includes an analog to digital converter that samples the analog signal after baseline wandering compensation, a digital equalizer to condition the digital samples, and the slicer to determine transmitted symbols from the digital samples. The transceiver system includes a subtraction block that determines the difference between an input and an output of the slicer, a digital to analog converter that converts a difference between the input and the output of the slicer, a low pass filter that filters out high frequency components of the difference between the input and the output of the slicer thereby to extract out the baseline wandering, and a signal summation circuit that subtracts the baseline wandering from the analog signal.

Abstract: A receiver system that includes an ADC for converting analog values to digital representations. A digital representation is a sum of discrete values some of which are non-binary scaled and the other are binary scaled. The ADC includes dedicated comparators to determine whether to add or to subtract the non-binary scaled values. A comparator is used to determine whether to add or to subtract the binary scaled values. The ADC further calibrates offset voltages of the comparators to substantially remove dead zone and conversion errors, without compromising the conversion speed. The calibration can be performed both in foreground and background.

Abstract: A receiver system that includes an ADC for converting analog values to digital representations. A digital representation is a sum of discrete values some of which are non-binary scaled and the other are binary scaled. The ADC includes dedicated comparators to determine whether to add or to subtract the non-binary scaled values. A comparator is used to determine whether to add or to subtract the binary scaled values. The ADC further calibrates offset voltages of the comparators to substantially remove dead zone and conversion errors, without compromising the conversion speed. The calibration can be performed both in foreground and background.

Abstract: A 3DIC includes a die and a substrate. The die includes multiple bumps to provide electrical connection the substrate. The substrate includes multiple elongated contact pads. The elongated contact pads making electrical contact with the bumps and shaped to maintain alignment with the bumps over a temperature range.

Abstract: Disclosed is a content addressable memory (CAM). The content addressable memory array includes a memory array and a data match module. The memory array includes multiple memory rows. Each memory row is configured to store a first data word and a second data word. The data match module includes a first match circuitry configured to compare a first match word to the first data word of a memory row, and to generate a first match output based on the comparison between the first match word and the first data word of the memory row. The data match module further includes a second match circuitry configured to compare a second match word to the second data word of the memory row, and to generate a second match output based on the comparison between the second match word and the second data word of the memory row.

Abstract: Disclosed is a probe card for testing a wireless module on an integrated circuit die contained on a wafer. The probe card includes a connector and a plurality of probes. The connector connects the probe card to test equipment. The plurality of probes connects the probe card to a wafer containing a plurality of integrated circuit dies. The probe card additionally includes an antenna configured to transmit a wireless test signal to be received by at least one of the integrated circuit dies, and/or to receive a wireless signal transmitted by at least one of the integrated circuit dies.

Abstract: A memory interface architecture uses a serializer/deserializer (SerDes) to connect a memory array on one semiconductor die to a device on another semiconductor die, for example via a fast interposer.

Abstract: Memory optimization of integrated circuit (IC) design using generic memory models is presented. One method includes accessing a register transfer level (RTL) description for the IC design that includes generic memory interface calls to generic memory models for each memory instance. The generic memory call interface includes a set of memory parameters. The method also includes processing the RTL description of the IC design as a step in a design flow for the IC design by processing specific memory models for the memory instances, wherein the specific memory model for each memory instance is generated from the generic memory model using the memory parameters corresponding to the memory instance. The method can also include generating specific memory models (e.g., simulation model, timing model, and layout model) for each memory instance based on a given set of values of memory parameters for the memory instance.

Abstract: A ternary content addressable memory (TCAM) is disclosed. The TCAM includes a memory array, a data match module, and compare circuitry. The memory array stores a data entry for a data word and a corresponding duplicate data entry for the data word. The data match module compares the data entry to an input word to produce a first match output, and compares the duplicate data entry to the input word to produce a second match output. The compare circuitry compares the first match output and the second match output.

Abstract: Memory optimization of integrated circuit (IC) design using generic memory models is presented. One method includes accessing a register transfer level (RTL) description for the IC design that includes generic memory interface calls to generic memory models for each memory instance. The generic memory call interface includes a set of memory parameters. The method also includes processing the RTL description of the IC design as a step in a design flow for the IC design by processing specific memory models for the memory instances, wherein the specific memory model for each memory instance is generated from the generic memory model using the memory parameters corresponding to the memory instance. The method can also include generating specific memory models (e.g., simulation model, timing model, and layout model) for each memory instance based on a given set of values of memory parameters for the memory instance.

Abstract: Memory optimization of integrated circuit (IC) design using generic memory models is presented. One method includes accessing a register transfer level (RTL) description for the IC design that includes generic memory interface calls to generic memory models for each memory instance. The generic memory call interface includes a set of memory parameters. The method also includes processing the RTL description of the IC design as a step in a design flow for the IC design by processing specific memory models for the memory instances, wherein the specific memory model for each memory instance is generated from the generic memory model using the memory parameters corresponding to the memory instance. The method can also include generating specific memory models (e.g., simulation model, timing model, and layout model) for each memory instance based on a given set of values of memory parameters for the memory instance.

Abstract: Disclosed is a content addressable memory (CAM). The content addressable memory array includes a memory array and a data match module. The memory array includes multiple memory rows. Each memory row is configured to store a first data word and a second data word. The data match module includes a first match circuitry configured to compare a first match word to the first data word of a memory row, and to generate a first match output based on the comparison between the first match word and the first data word of the memory row. The data match module further includes a second match circuitry configured to compare a second match word to the second data word of the memory row, and to generate a second match output based on the comparison between the second match word and the second data word of the memory row.

Abstract: A binary content addressable memory (BCAM) is disclosed. The BCAM includes a memory array, data signature circuitry, and a data match module and compare circuitry. The memory array is configured to store a data entry for a data word and a corresponding data signature for the data entry. The data signature circuitry is configured to calculate the data signature for the data entry and to calculate the data signature for an input word. The data match module compares the data entry to the input word to produce a content match output, and compares the data signature for the data entry to the data signature of the input word to produce a signature match output. The compare circuitry compares the content match output and the data signature match output.

Abstract: In one aspect, a method for providing design point recommendations for an integrated circuit (IC) design is disclosed. The method comprises receiving an IC design along with a reference PPA (power, performance, area) metric at a reference design point, and a target PPA metric. The method also comprises estimating trial PPA metrics for the IC design at multiple design points, wherein estimating trial PPA metric at each design point includes accessing a PPA database containing PPA metrics for multiple test components, determining scale factors from the reference design point to the trial design point for test components equivalent to components of the IC design, and applying the scale factors to the reference PPA metric to determine the trial PPA metric for the trial design point. The method further comprises recommending a trial design point based on the estimated trial PPA metric and the received target PPA metric.

Abstract: A silicon interposer with redundant thru-silicon vias. The silicon interposer includes a first trace structure on a first side of the interposer and a second trace structure on a second side of the interposer. The silicon interposer also includes at least two redundant thru-silicon vias connecting the first trace structure to the second trace structure.

Abstract: In one aspect, a method for providing design point recommendations for an integrated circuit (IC) design is disclosed. The method comprises receiving an IC design along with a reference PPA (power, performance, area) metric at a reference design point, and a target PPA metric. The method also comprises estimating trial PPA metrics for the IC design at multiple design points, wherein estimating trial PPA metric at each design point includes accessing a PPA database containing PPA metrics for multiple test components, determining scale factors from the reference design point to the trial design point for test components equivalent to components of the IC design, and applying the scale factors to the reference PPA metric to determine the trial PPA metric for the trial design point. The method further comprises recommending a trial design point based on the estimated trial PPA metric and the received target PPA metric.

Abstract: In one aspect, a method for providing design point recommendations for an integrated circuit (IC) design is disclosed. The method comprises receiving an IC design along with a reference PPA (power, performance, area) metric at a reference design point, and a target PPA metric. The method also comprises estimating trial PPA metrics for the IC design at multiple design points, wherein estimating trial PPA metric at each design point includes accessing a PPA database containing PPA metrics for multiple test components, determining scale factors from the reference design point to the trial design point for test components equivalent to components of the IC design, and applying the scale factors to the reference PPA metric to determine the trial PPA metric for the trial design point. The method further comprises recommending a trial design point based on the estimated trial PPA metric and the received target PPA metric.

Abstract: In one aspect, a method for providing design point recommendations for an integrated circuit (IC) design is disclosed. The method comprises receiving an IC design along with a reference PPA (power, performance, area) metric at a reference design point, and a target PPA metric. The method also comprises estimating trial PPA metrics for the IC design at multiple design points, wherein estimating trial PPA metric at each design point includes accessing a PPA database containing PPA metrics for multiple test components, determining scale factors from the reference design point to the trial design point for test components equivalent to components of the IC design, and applying the scale factors to the reference PPA metric to determine the trial PPA metric for the trial design point. The method further comprises recommending a trial design point based on the estimated trial PPA metric and the received target PPA metric.

Abstract: In one aspect, a method for providing design point recommendations for an integrated circuit (IC) design is disclosed. The method comprises receiving an IC design along with a reference PPA (power, performance, area) metric at a reference design point, and a target PPA metric. The method also comprises estimating trial PPA metrics for the IC design at multiple design points, wherein estimating trial PPA metric at each design point includes accessing a PPA database containing PPA metrics for multiple test components, determining scale factors from the reference design point to the trial design point for test components equivalent to components of the IC design, and applying the scale factors to the reference PPA metric to determine the trial PPA metric for the trial design point. The method further comprises recommending a trial design point based on the estimated trial PPA metric and the received target PPA metric.

Abstract: In one aspect, a method for providing design point recommendations for an integrated circuit (IC) design is disclosed. The method comprises receiving an IC design along with a reference PPA (power, performance, area) metric at a reference design point, and a target PPA metric. The method also comprises estimating trial PPA metrics for the IC design at multiple design points, wherein estimating trial PPA metric at each design point includes accessing a PPA database containing PPA metrics for multiple test components, determining scale factors from the reference design point to the trial design point for test components equivalent to components of the IC design, and applying the scale factors to the reference PPA metric to determine the trial PPA metric for the trial design point. The method further comprises recommending a trial design point based on the estimated trial PPA metric and the received target PPA metric.