Patents Assigned to eSionic Corp.
  • Liquid composite compositions using non-volatile liquids and nanoparticles and uses thereof
    Patent number: 9403190
    Abstract: A solvent composition comprising an organic solvent; dispersed nanoparticles; and a non-volatile electrolyte is provided. A method of forming a liquid composite composition is provided.
    Type: Grant
    Filed: September 23, 2013
    Date of Patent: August 2, 2016
    Assignee: eSionic Corp.
    Inventor: Seth A. Miller
  • Methods of treating copper surfaces for enhancing adhesion to organic substrates for use in printed circuit boards
    Patent number: 9345149
    Abstract: Embodiments of the present invention relates generally to the manufacture of printed circuit boards (PCB's) or printed wiring boards (PWB's), and particularly to methods for treating smooth copper surfaces to increase the adhesion between a copper surface and an organic substrate. More particularly, embodiments of the present invention related to methods of achieving improved bonding strength of PCBs without roughening the topography of the copper surface. The bonding interface between the treated copper and the resin layer of the PCB exhibits excellent resistance to heat, moisture, and chemicals involved in post-lamination process steps.
    Type: Grant
    Filed: July 6, 2010
    Date of Patent: May 17, 2016
    Assignee: eSionic Corp.
    Inventors: Jen-Chieh Wei, Zhiming Liu, Steven Z. Shi, Werner G. Kuhr
  • Liquid composite compositions using non-volatile liquids and nanoparticles and uses thereof
    Patent number: 9120121
    Abstract: A solvent composition comprising an organic solvent; dispersed nanoparticles; and a non-volatile electrolyte is provided. A method of forming a liquid composite composition is provided.
    Type: Grant
    Filed: September 18, 2013
    Date of Patent: September 1, 2015
    Assignee: eSionic Corp.
    Inventor: Seth A. Miller