Abstract: An apparatus and method for the electroless plating of articles. A tank is provided for sequentially containing the respective constituent baths corresponding to the steps of the electroless plating process. An article to be plated, such as a printed circuit board, is supported in the center of the tank immersed in the constituent bath container therein. A pair of inwardly facing parallel manifolds are disposed at opposite ends of the tank. The constituent solution is pumped through a nozzle matrix in the inward facing wall of a first manifold onto the article and is simultaneously sucked away from the opposing side of the article through the matrix of the nozzles defined in the inward facing wall of a second manifold. The direction of pumping is alternated for periodically reversing the direction of suction and impingement.

Abstract: A sulfuroxy acid reducing agent composition can be used to treat the metallic conductive pathways formed in or on the surface of printed wiring boards in order to assure that the copper pathways are firmly and securely bonded to laminate layers of layered printed wiring board articles. The sulfuroxy acid reducing agent treatment promotes the rapid formation of a uniform metal oxide layer on the printed wiring board conductive pathways, when the printed circuit boards are exposed to an oxiding agent, which insures that the compositions used in forming the printed wiring board laminates do not interact with the active copper metal preventing delamination.

Abstract: An accurate repeatable quantitative determination of the concentration of organic additives, additive breakdown products and organic contaminants in plating baths can be made using a novel high-pressure liquid chromatography apparatus in combination with size exclusion chromatography and total organic carbon analysis.

Abstract: A method for the preparation of an alkali metal dialkylaminothioxomethyl-thioalkanesulfonate composition comprising reacting a monoamine with carbon disulfide to form a dithiocarbamic acid monoamine salt, reacting the salt with an alkyl sultone to form an amino thioxo methyl thioalkane sulfonate monoamine salt, and sulfonate salt with an alkali metal base to form an alkali metal salt of the amino thioxo methyl thioalkane sulfonate composition.

Abstract: An accurate repeatable quantitative determination of the concentration of organic composition analytes, breakdown products and organic contaminants in plating baths, and in chemical baths other than the plating bath can be made using a novel high-pressure liquid chromatography apparatus in combination with size exclusion chromatography and total organic carbon analysis.

Abstract: An apparatus and method for the electroless plating of articles. A tank is provided for sequentially containing the respective constituent baths corresponding to the steps of the electroless plating process. An article to be plated, such as a printed circuit board, is supported in the center of the tank immersed in the constituent bath contained therein. A pair of inwardly facing parallel manifolds are disposed at opposite ends of the tank. The constituent solution is pumped through a nozzle matrix in the inward facing wall of a first manifold onto the article and is simultaneously sucked away from the opposing side of the article through the matrix of the nozzles defined in the inward facing wall of a second manifold. The direction of pumping is alternated for periodically reversing the direction of suction and impingement.

Abstract: Methods and apparatus for providing fine line, high density multiple layer printed circuit board packages are disclosed. In the method for fabricating multiple layer printed circuit board package, a printed circuit board is formed having a conductive circuit pattern embedded in and integral with an insulator material substrate, such that the surface of the conductive circuit pattern is exposed along one surface of the substrate, and lays flush and coplanar with therewith. At least two of said boards are stacked with a layer of insulator material interposed between each pair of adjacent boards. The entire assembly is heat-pressed together to form a homogenous block of insulator material having conductive circuit patterns embedded and integrally molded therein.