Patents Assigned to Eupec Europaeische Gesellschaft Fuer Leistungs-Halbletter mbh & Co. KG
  • Semiconductor module
    Patent number: 5508560
    Abstract: A semiconductor module includes a metal base plate having a plane upper sace and a convex lower surface. An electrically insulating and thermally conductive substrate is material-lockingly connected to the upper surface of the metal base plate. Semiconductor chips are material-lockingly connected to an upper surface of the substrate.
    Type: Grant
    Filed: November 8, 1994
    Date of Patent: April 16, 1996
    Assignee: Eupec Europaeische Gesellschaft Fuer Leistungs-Halbletter mbh & Co. KG
    Inventors: Werner Koehler, Reinhold Spanke