Abstract: A light-emitting diode display apparatus including a circuit substrate, a display matrix, a driving circuit, and an interface circuit is provided. The display matrix is disposed on the circuit substrate, and has a plurality of display pixels. The driving circuit is disposed on the circuit substrate, and has at least one driver. The driver has a programmable planning area. The interface circuit is disposed on the circuit substrate, and electrically coupled to the driving circuit. The interface circuit is configured to receive input information, and transports the input information to the driving circuit.

Abstract: A light emitting diode chip including a substrate and a light emitting diode element layer is provided. The substrate has a growth surface and a plurality of microstructures on the growth surface. An area of the growth surface occupied by the microstructures is A1 and an area of the growth surface not occupied by the microstructures is A2, such that A1 and A2 satisfy the relation of 0.1?A2/(A1+A2)?0.5. The light emitting diode element layer is disposed on the growth surface of the substrate.

Abstract: A light emitting device may comprise a wing portion of an electrode exposed from the resin housing. The wing portion may be made by a single or multiple stamp cutting process. To increase the connecting region between the electrode and solder, the outer side surface of the wing portion is an uneven surface. The device may further comprise a protective plating layer and an external protective plating layer. The protective plating layer may be coated on the top surface, bottom surface and a portion of the side surface of the electrode. The external portative plating layer would be coated on the outer surface of the wing region. The light reflection of the device from top surface of the electrode portion can be maintained and the outer side surface of wing portion can be protected for improving the reliability of connection between light emitting device and outer substrate.

Abstract: A carrier leadframe, including a frame body and a carrier, is provided. The frame body includes at least one supporting portion, and the carrier includes a shell and at least one electrode portion and is mechanically engaged with the frame body via the supporting portion. A method for manufacturing the carrier leadframe as described above, as well as a light emitting device made from the carrier leadframe and a method for manufacturing the device, are also provided. The carrier leadframe has carriers that are separate in advance and mechanically engaged with the frame body, thereby facilitating the quick release of material after encapsulation. Besides, in the carrier leadframe as provided, each carrier is electrically isolated from another carrier, so the electric measurement can be performed before the release of material. Therefore, the speed and yield of production of the light emitting device made from the carrier leadframe is improved.

Abstract: A carrier leadframe, including a frame body and a carrier, is provided. The frame body includes at least one supporting portion, and the carrier includes a shell and at least one electrode portion and is mechanically engaged with the frame body via the supporting portion. A method for manufacturing the carrier leadframe as described above, as well as a light emitting device made from the carrier leadframe and a method for manufacturing the device, are also provided. The carrier leadframe has carriers that are separate in advance and mechanically engaged with the frame body, thereby facilitating the quick release of material after encapsulation. Besides, in the carrier leadframe as provided, each carrier is electrically isolated from another carrier, so the electric measurement can be performed before the release of material. Therefore, the speed and yield of production of the light emitting device made from the carrier leadframe is improved.

Abstract: A carrier leadframe, including a frame body and a carrier, is provided. The frame body includes at least one supporting portion, and the carrier includes a shell and at least one electrode portion and is mechanically engaged with the frame body via the supporting portion. A method for manufacturing the carrier leadframe as described above, as well as a light emitting device made from the carrier leadframe and a method for manufacturing the device, are also provided. The carrier leadframe has carriers that are separate in advance and mechanically engaged with the frame body, thereby facilitating the quick release of material after encapsulation. Besides, in the carrier leadframe as provided, each carrier is electrically isolated from another carrier, so the electric measurement can be performed before the release of material. Therefore, the speed and yield of production of the light emitting device made from the carrier leadframe is improved.

Abstract: A light emitting diode device is provided. The light emitting diode device has a substrate, a plurality of metal pads, a plurality of LEDs and a first metal conductive wire. A plurality of first metal pads of the metal pads are disposed on a first surface of the substrate, and the LEDs are disposed on a part of the first metal pads. Each of the LEDs has at least one first electrode contact. The first electrode contact of each of the LEDs electrically connected to the first metal conductive wire has the same electrode contact polarity. Moreover, another light emitting diode device is also provided.

Abstract: A light emitting diode (LED) packaging structure including a metal pad, an electric static discharge (ESD) protection element and an LED chip is provided. The metal pad has a first pad portion having a first top surface with a first concave configured thereon and a second pad portion having a second top surface with a second concave configured thereon. The ESD protection element has two first electrode portions respectively configured in the first concave and the second concave. The LED chip is located above the ESD protection element and has two second electrode portions respectively configured on the first top surface and the second top surface. A frame and a light emitting device having the frame that both include the above LED packaging structure are described herein. A light emitting device having an omni-directional light emitting effect is also described and includes the above LED packaging structure.

Abstract: A carrier leadframe, including a frame body and a carrier, is provided. The frame body includes at least one supporting portion, and the carrier includes a shell and at least one electrode portion and is mechanically engaged with the frame body via the supporting portion. A method for manufacturing the carrier leadframe as described above, as well as a light emitting device made from the carrier leadframe and a method for manufacturing the device, are also provided. The carrier leadframe has carriers that are separate in advance and mechanically engaged with the frame body, thereby facilitating the quick release of material after encapsulation. Besides, in the carrier leadframe as provided, each carrier is electrically isolated from another carrier, so the electric measurement can be performed before the release of material. Therefore, the speed and yield of production of the light emitting device made from the carrier leadframe is improved.

Abstract: A light-emitting device with multi-color temperature and multi-loop configuration is provided. The light-emitting device may include a substrate, multiple light sources disposed on the substrate, a light-emitting unit covering the light sources, a first circuit and a second circuit. Each light source may be configured to emit a respective primary radiation. The light-emitting unit may include multiple loops, each of which covering at least one of the light sources. Each loop may be adjacent to and in contact with at least another loop. A first number of the light sources covered by one or more odd-numbered loops of the loops may be electrically connected to the first circuit. A second number of the light sources covered by one or more even-numbered loops of the loops may be electrically connected to the second circuit.

Abstract: A light emitting diode chip including a substrate and a light emitting diode element layer is provided. The substrate has a growth surface and a plurality of microstructures on the growth surface, wherein an area of the growth surface occupied by the microstructures is A1 and an area of the growth surface not occupied by the micro-structures is A2, wherein A1 and A2 satisfies the relation of 0.1?A2/(A1+A2)?0.5. The light emitting diode element layer is disposed on the growth surface of the substrate.

Abstract: Embodiments of a light emitting device, a surface mounted device-type light emitting device and a display device are provided. In one aspect, a light emitting device may include a main body and a light source. The main body may include a base and a number of terminals. The base may have a support surface. Each of the terminals may respectively have a welding portion such that the welding portions of the terminals form a connection surface with a first angle between the support surface and the connection surface. The first angle may be between 0 degree and 90 degrees. The light source may be disposed on the support surface and electrically connected to one or more of the terminals.

Abstract: Various examples of a carrier structure and lighting device are described. A carrier structure configured to carry an LED includes a housing and a lead frame. The housing defines a concavity. The lead frame includes a main board portion having a main board through hole, at least two insertion portions extending from the main board portion into the main board through hole, and two electrode portions configured to be electrically coupled to the LED. The housing is disposed over the at least two insertion portions with the at least two insertion portions inserted into the housing. The concavity of the housing expose the electrode portions. Each of the electrode portions has a respective protrusion sub-portion that extends outside of the housing. Additionally, a lighting device utilizing the carrier structure is also provided.

Abstract: A light-emitting device with multi-color temperature and multi-loop configuration is provided. The light-emitting device comprises a substrate, multiple light sources disposed on the substrate, and a light-emitting unit covering the light sources and at least a portion of the substrate. Each of the light sources is configured to emit a respective primary radiation. The light-emitting unit comprises multiple wavelength conversion components, each of which may include a respective fluorescent material. Each wavelength conversion component emits a respective converted radiation, upon absorbing a portion of the primary radiation from one or more of the light sources, and mixes the respective converted radiation with a portion of the primary radiation from the one or more of the light sources that is not absorbed to form a respective mixed radiation. Each wavelength conversion component is adjacent to, and at least partially contacts, at least another one of the wavelength conversion components.

Abstract: A phosphor composition and a white light emitting device using the same are disclosed. The white light emitting device includes a blue light emitting diode and a phosphor composition disposed on the blue light emitting diode, wherein the phosphor composition includes a yellow lanthanum silicon nitride, a yellow ?-SiAlON and a red CaAlSiN, and the weight proportion of the yellow lanthanum silicon nitride, the yellow ?-SiAlON and the red CaAlSiN is 1: 1:0.3˜0.45.

Abstract: Various examples of a light emitting diode (LED) package structure and a manufacturing method thereof are described. In one aspect, a LED package structure includes a carrier, a LED chip, a first annular barricade, a second annular barricade and a fluorescent encapsulant. The LED chip is electrically connected to the carrier. The first annular barricade and the second annular barricade are disposed around the LED chip, with the second annular barricade disposed between the LED chip and the first annular barricade. The fluorescent encapsulant is disposed on the carrier and at least covers the LED chip and the second annular barricade. The fluorescent encapsulant includes at least a type of phosphor and at least a type of gel with the phosphor distributed over a surface of the LED chip.

Abstract: A lighting emitting diode (LED) device includes a first adjust module and a second adjust module. The first adjust module includes at least one first LED and has a first internal impedance having a first characteristic curve. A range covered by the first characteristic curve includes a first incomplete conduction region and a first conduction region. As the current increases from zero value and up, the first internal impedance decreases exponentially in the first incomplete conduction region, is approximately linear in the first conduction region. The second adjust module includes an impedance-providing component and an electronic component coupled in series. The second adjust module is coupled in parallel with the first adjust module. The second adjust module has a second internal impedance having a second characteristic curve. The first characteristic curve and the second characteristic curve match one another.

Abstract: There is provided a semiconductor integrated circuit for an optical sensor for receiving environmental light through a cover member that attenuates visible light and transmits infrared light and a collecting lens, performing luminosity factor correction based on an amount of received light, and detecting an illuminance, wherein the semiconductor integrated circuit includes a first light receiving element having a first spectral property; a second light receiving element having a second spectral property; and a luminosity factor correction unit configured to perform the luminosity factor correction according to output of the first light receiving element and output of the second light receiving element, wherein the luminosity factor correction unit includes an AD conversion unit performed by time division on the output of the first light receiving element and the output of the second light receiving element, and a calculating unit subtracting digital signals obtained by the conversion.

Abstract: The present disclosure provides a flip chip type light emitting diode which comprises a substrate and a light emitting diode chip. The substrate comprises a body, a plurality of third pads, a fourth pad, a first electrode, a second electrode, a plurality of first vias, and a second via. The body has a first surface and a second surface opposite to the first surface. The third pads and the fourth pad are disposed on the first surface of the body. The first electrode and the second electrode are disposed on the second surface of the body. The first vias traverse through the body and are each electrically coupled to a respective one of the third pads and the first electrode. The second via traverses through the body and is electrically coupled to the fourth pad and the second electrode.

Abstract: A light emitting diode (LED) device comprises a first lead frame, a second lead frame, a LED die and at least one bump. The LED die is fixed on and electrically connected to the first lead frame. The second lead frame separated from the first lead frame with a distance is connected to the LED die. The bump disposed on at least one of the first lead frame and the second lead frame to identify a gripping space for allowing an electronic element inserted or gripped therein.