Abstract: An illumination source includes a laser driver unit configured to emit a plasma sustaining beam. An ingress collimator receives the plasma sustaining beam and produces a collimated ingress beam. A focusing optic receives the collimated ingress beam and produce a focused sustaining beam. A sealed lamp chamber contains an ionizable media that, once ignited, forms a high intensity light emitting plasma having a waist size smaller than 150 microns. The sealed lamp chamber further includes an ingress window configured to receive the focused sustaining beam and an egress window configured to emit the high intensity light. An ignition source is configured to ignite the ionizable media, and an exit fiber is configured to receive and convey the high intensity light. The high intensity light is white light with a black body spectrum, and the exit fiber has a diameter in the range of 200-500 micrometers.

Abstract: An illumination source includes a laser driver unit configured to emit a plasma sustaining beam. An ingress collimator receives the plasma sustaining beam and produces a collimated ingress beam. A focusing optic receives the collimated ingress beam and produce a focused sustaining beam. A sealed lamp chamber contains an ionizable media that, once ignited, forms a high intensity light emitting plasma having a waist size smaller than 150 microns. The sealed lamp chamber further includes an ingress window configured to receive the focused sustaining beam and an egress window configured to emit the high intensity light. An ignition source is configured to ignite the ionizable media, and an exit fiber is configured to receive and convey the high intensity light. The high intensity light is white light with a black body spectrum, and the exit fiber has a diameter in the range of 200-500 micrometers.

Abstract: An illumination source includes a laser driver unit configured to emit a plasma sustaining beam. An ingress collimator receives the plasma sustaining beam and produces a collimated ingress beam. A focusing optic receives the collimated ingress beam and produce a focused sustaining beam. A sealed lamp chamber contains an ionizable media that, once ignited, forms a high intensity light emitting plasma having a waist size smaller than 150 microns. The sealed lamp chamber further includes an ingress window configured to receive the focused sustaining beam and an egress window configured to emit the high intensity light. An ignition source is configured to ignite the ionizable media, and an exit fiber is configured to receive and convey the high intensity light. The high intensity light is white light with a black body spectrum, and the exit fiber has a diameter in the range of 200-500 micrometers.

Abstract: An apparatus configured to sense presence and motion in a monitored space is presented. The apparatus includes a dual-element assembly with a first thermal sensing element and a second thermal sensing element configured to produce a direct current output that is sustained at a level substantially proportional to an amount of thermal energy being received at the thermal sensing elements. A lens array (or equivalent optics) is coupled to the elements, having a plurality of lenses directing incident thermal energy from a plurality of optically-defined spatial zones onto the sensing elements. An electronic circuitry is configured to read a resulting signal of the dual-element assembly and an individual output signal of each the first thermal sensing element and the second thermal sensing element.

Abstract: An unreleased thermopile IR sensor and method of fabrication is provided which includes a new thermally isolating material and an ultra-thin material based sensor which, in combination, provide excellent sensitivity without requiring a released membrane structure. The sensor is fabricated using a wafer transfer technique in which a substrate assembly comprising the substrate and new thermally isolating material is bonded to a carrier substrate assembly comprising a carrier substrate and the ultra-thin material, followed by removal of the carrier substrate. As such, temperature restrictions of the various materials are overcome.

Abstract: A motion sensing device includes an infrared radiation (IR) sensor configured receive signal IR from a warm object and background IR to produce a direct current output. A first transformation filter receives the direct current output and produces a filtered background. A second transformation filter receives the direct current output and produces a filtered signal. A rating compares the filtered signal and the filtered background to produce a result signal based on a detected difference between the filtered signal and the filtered background.

Abstract: Systems and methods for recognizing motion made by a moving person are presented. The system includes a thermal sensor configured to generate a low frequency or direct current signal upon receiving thermal energy. A spatially modulating optic is disposed between the thermal sensor and the warm object. The optic is configured to modulate the thermal energy received by the thermal sensor as a function of an orientation of the moving person with respect to the thermal sensor. An electronics unit in communication with the thermal sensor includes a memory and a processor. The processor is configured by the memory to detect a change in the thermal sensor signal and recognize a characteristic of the thermal sensor signal.

Abstract: A radiation sensing device for sensing first radiation (15) comprises a radiation sensor (11) for sensing the first radiation and at least one first radiation guiding member (13) forming at least a part of a first radiation path for guiding, and preferably converging or focusing, the first radiation towards the sensor. The first radiation guiding member (13) also forms at least a part of a second radiation path for guiding second radiation emitted by an illumination device (12). A control circuit (20) comprises a first sensor circuit (21) for operating one or more radiation sensors (11), an illumination circuit (22) for operating one or more illumination devices (22), and at least one connection (26) amongst said circuits (21, 22).

Abstract: An apparatus configured to sense presence and motion in a monitored space includes one or more thermal sensing devices and a lens array. Each thermal sensing device is configured to produce a direct current output that is sustained at a level substantially proportional to an amount of thermal energy being received at the thermal sensing device. The lens array is coupled to the one or more thermal sensing devices and includes multiple lenses, each of which is configured to direct incident thermal energy from at least a respective one of multiple different physical zones located within the monitored space onto the one or more thermal sensing devices.

Abstract: A method for manufacturing an imaging device is presented. The method starts with providing a wafer having a membrane with an opening bonded to a substrate. A photoresist layer is deposited over the membrane and wafer surface. A portion of the substrate back surface under a central part of the membrane is etched anisotropicly. A first region of the photoresist layer is removed, exposing an opening in the membrane, so that a first isotropic etching of the substrate is performed through the membrane opening. A second region of the photoresist layer is stripped, exposing a second membrane opening, providing access for a second isotropic etching of the substrate through the first and/or second membrane opening.

Abstract: A radiation sensing device for sensing first radiation (15) comprises a radiation sensor (11) for sensing the first radiation and at least one first radiation guiding member (13) forming at least a part of a first radiation path for guiding, and preferably converging or focusing, the first radiation towards the sensor. The first radiation guiding member (13) also forms at least a part of a second radiation path for guiding second radiation emitted by an illumination device (12). A control circuit (20) comprises a first sensor circuit (21) for operating one or more radiation sensors (11), an illumination circuit (22) for operating one or more illumination devices (22), and at least one connection (26) amongst said circuits (21, 22).

Abstract: A method for manufacturing an imaging device in a semiconductor substrate is disclosed. The substrate includes a first surface, a second surface substantially opposite the first surface, and a thickness defined by a distance between the first surface and the second surface. A trench is fabricated in the semiconductor substrate first surface. A passivation layer is applied over the substrate first surface and the trench, optionally filling the trench by depositing a conformal layer over the substrate first surface. The conformal layer and the passivation layer are planarized from the substrate first surface, and a membrane is fabricated on the substrate first surface. From the substrate second surface, a cavity is formed in the substrate abutting the membrane and at least a portion of the trench via the unmasked region.

Abstract: A sensor assembly is disclosed that includes a hollow casing having a radiation entrance opening. A radiation-transmissive optic is at the radiation entrance opening. A substrate is inside and sealed against the hollow casing. An optical sensing element is coupled to the substrate and configured to sense radiation that has passed through the radiation-transmissive optic. A method of manufacturing the sensor assembly also is disclosed.

Abstract: Systems and methods for recognizing a gesture made by a warm object are presented. The system includes a thermal sensor configured to generate a low frequency or direct current signal upon receiving thermal energy. A spatially modulating optic is disposed between the thermal sensor and the warm object. The optic is configured to modulate the thermal energy received by the thermal sensor as a function of an orientation of the warm object with respect to the thermal sensor. An electronics unit in communication with the thermal sensor includes a memory and a processor. The processor is configured by the memory to detect a change in the thermal sensor signal and recognize a characteristic of the thermal sensor signal.

Abstract: A method of manufacturing a pixel structure having an umbrella absorber is disclosed. The method includes providing a substrate with a membrane on a first surface of the substrate. The membrane has one or more openings that expose one or more portions of the first surface, and includes a thermopile. A sacrificial layer is deposited on the membrane and in the one or more openings. The sacrificial layer is patterned to expose a portion of the membrane associated with one or more hot junctions of the thermopile. A rigid, thermally-conductive layer is formed on the sacrificial layer and on the exposed portion of the membrane associated with the one or more hot junctions of the thermopile. An absorber is deposited on the rigid, thermally-conductive layer. A cavity is formed in the substrate from a second surface of the substrate to the membrane and the sacrificial layer is removed.

Abstract: A method for manufacturing an imaging device in a semiconductor substrate is disclosed. The substrate includes a first surface, a second surface substantially opposite the first surface, and a thickness defined by a distance between the first surface and the second surface. A trench is fabricated in the semiconductor substrate first surface. A passivation layer is applied over the substrate first surface and the trench, optionally filling the trench by depositing a conformal layer over the substrate first surface. The conformal layer and the passivation layer are planarized from the substrate first surface, and a membrane is fabricated on the substrate first surface. From the substrate second surface, a cavity is formed in the substrate abutting the membrane and at least a portion of the trench via the unmasked region.

Abstract: A method for manufacturing an imaging device is presented. The method starts with providing a wafer having a membrane with an opening bonded to a substrate. A photoresist layer is deposited over the membrane and wafer surface. A portion of the substrate back surface under a central part of the membrane is etched anisotropicly. A first region of the photoresist layer is removed, exposing an opening in the membrane, so that a first isotropic etching of the substrate is performed through the membrane opening. A second region of the photoresist layer is stripped, exposing a second membrane opening, providing access for a second isotropic etching of the substrate through the first and/or second membrane opening.

Abstract: A method of manufacturing a pixel structure having an umbrella absorber is disclosed. The method includes providing a substrate with a membrane on a first surface of the substrate. The membrane has one or more openings that expose one or more portions of the first surface, and includes a thermopile. A sacrificial layer is deposited on the membrane and in the one or more openings. The sacrificial layer is patterned to expose a portion of the membrane associated with one or more hot junctions of the thermopile. A rigid, thermally-conductive layer is formed on the sacrificial layer and on the exposed portion of the membrane associated with the one or more hot junctions of the thermopile. An absorber is deposited on the rigid, thermally-conductive layer. A cavity is formed in the substrate from a second surface of the substrate to the membrane and the sacrificial layer is removed.

Abstract: Apparatus and methods for proximity detection include a passive proximity detecting device for detecting humans within a detection area and controlling a controlled device. A sensor includes a plurality of pixels arranged in a substantially contiguous array. Each pixel is configured to detect infrared radiation emitted by an object in a predetermined temperature range within the detection area. In response to detecting the object a detection signal is generated having a signal level proportional to the infrared radiation emitted by said object received by the sensor. A processor in communication with the sensor is configured to receive said detection signal, to derive an object distance and a second object parameter using, a signal level of the detection signal.

Abstract: A vertically stacked thermopile and an IR sensor using said stacked thermopiles are provided. The vertically stacked thermopile may include multiple thermocouples stacked vertically on one another. The thermocouples may be connected in series, parallel, or a combination of series and parallel. One or more vertically stacked thermopiles may be included in an IR sensor and the thermopiles may be connected in series, parallel, or a combination of series and parallel.