Abstract: A tray includes adjustably positioned support members for supporting multiple lead integrated circuit components of various sizes and configurations. The components are supported by the support members so that the component leads do not make contact with said support members. A cover is disposed on the tray to protect the components when storing and/or transporting same. The cover is arranged to receive another tray whereby a stackable arrangement of covered trays is provided. The stackable arrangement may be strapped for providing a storable/transportable package of microelectronic components.