Patents Assigned to Fiarchild Korea Semiconductor, Ltd
  • Power module flip chip package
    Patent number: 7492043
    Abstract: A power module flip chip package is provided. The power module flip chip package includes a package carrier having a front surface and a back surface facing the front surface, and a power semiconductor device electrically connected to the front surface of the package carrier via conductive bumps. The conductive bumps are electrically connected to a gate terminal, a source terminal, and a drain terminal of the power semiconductor device. The power module flip chip package has reduced resistance and inductance and improved reliability.
    Type: Grant
    Filed: August 26, 2004
    Date of Patent: February 17, 2009
    Assignee: Fiarchild Korea Semiconductor, Ltd
    Inventors: Seung-yong Choi, Jonathan A. Noquil