Patents Assigned to Fiarchild Semiconductor
  • Surface mountable optocoupler package
    Patent number: 6633030
    Abstract: An optocoupler package is disclosed. The optocoupler package comprises a carrier substrate and a plurality of conductive regions on the carrier substrate. An optoelectronic device, an optically transmissive medium, and a plurality of conductive structures can be on the carrier substrate.
    Type: Grant
    Filed: August 31, 2001
    Date of Patent: October 14, 2003
    Assignee: Fiarchild Semiconductor
    Inventor: Rajeev Joshi