Abstract: A metal base (1), and holes (12) therein, of a printed circuit board are given an insulating coat (2) produced from an epoxy compound in particulate form which is deposited and machined successively at either side. An insulating topology (16) in a photoresist imposed on the insulating coat (2) is metal-plated in vacuum. On removing the metal from the prominent portions of the topology (16) tracks (4) and connecting pads (5) of a layer (3) of conducting pattern are left. An insulating topology (18) consistent with the disposition of connecting pads (11) and connecting posts (10) interconnecting the layers (3, 6) of conducting patterns is formed and metal-plated. On removing the metal from the prominent portions an insulating layer (9) with connecting posts (10) and connecting pads (11) is left. Next, an insulating topology (19) consistent with the topology of the layer (6) of conducting pattern is formed and metal-plated.

Abstract: An articulated coupling has two cylindrical half-couplings facing each other at their end faces. Recesses are formed in the end faces which recesses in which a cage is installed in the recesses with a clearance. Radial coaxial openings are formed in the cage and the half-couplings and rollers are installed in the coaxial openings with clearances. The half-couplings are provided with a device for holding the rollers in the openings.