Abstract: A system comprising a light source, and a retention device configured to receive and retain a sample for measurement. The system includes a detector. An optical path couples light between the light source, the sample when present, and the detector. An optical objective is configured to couple light from the light source to the sample when present, and couple reflected light to the detector. A controller is configured to automatically control focus and/or beam path of the light directed by the optical objective to the sample when present. The system includes a spatially variable filter (SVF) positioned in the optical path. The SVF is configured to have spectral properties that vary as a function of illuminated position on the SVF.

Abstract: A system includes a light source configured to selectively output light. An optical objective is configured to couple the output light from the light source to a sample under measurement when present, and direct reflected light from the sample. A controller is configured to automatically control a color of the output light and a vertical position of the optical objective relative to the sample. The color of the light is selected from multiple colors. The vertical position includes a range of vertical positions scanned by the objective. A detector is configured to receive the reflected light and to detect focus, and output data representing a surface profile of the sample. The output data includes color images of the surface profile.

Abstract: Embodiments include a spectral reflectance system comprising a light source. The system includes a platform configured to retain a sample. The system includes an optical director positioned in the optical path between the light source and the platform. The optical director couples light from the light source to the platform. The system includes a detector positioned to receive reflected light from the sample. The detector generates a signal representing the reflected light. The system includes a focusing system coupled to the optical director. In response to the signal the focusing system automatically focuses the light on the sample by controlling a position of the optical director to maximize a strength of the signal.

Abstract: Embodiments include a spectral reflectance system comprising a detector and a light source coupled to a support member. The system includes a turret coupled to the support member. The turret is configured to receive objective lenses and configured to selectively position each lens in an imaging position relative to a sample to be imaged. A first objective lens is configured to image the sample at the detector when placed in the imaging position. A second objective lens includes an optical director that is configured to form an optical path with an auxiliary detector and image the sample at the auxiliary detector when the second objective lens is in the imaging position.

Abstract: Embodiments described herein include broadband light source system comprising an optic coupler including a plurality of input branches coupled to an output. The system includes a plurality of light sources coupled to the plurality of input branches. Each light source outputs light having a different wavelength distribution than any other light source of the plurality of light sources. The output emits a broadband light source comprising a combined spectral output of the plurality of light sources.

Abstract: A system comprising a calibration light source is described. The system includes a calibration optical fiber coupled to an output of the calibration light source and to an input slit of a spectrometer. The calibration optical fiber transmits light output of the calibration light source to the spectrometer via the slit. An input optical fiber is coupled to the input slit in addition to the calibration optical fiber. The input optical fiber transmits light-under-test to the spectrometer via the slit.

Abstract: A system comprising a light source configured to illuminate a sample under measurement. The system includes a detector configured to receive reflected light from the sample, and the detector generates a signal representing the reflected light. A spatially variable filter (SVF) is positioned in the optical path. The SVF is configured to have spectral properties that vary as a function of illuminated position on the SVF.

Abstract: Optical systems and methods are described that provide greater solving power for thin-film measurements in general, and provide a unique model-free solution for single-layer films in particular.

Abstract: Embodiments described herein correct errors in spectrometer outputs due to the presence of second-order light. Embodiments determine a relationship between first-order light and second-order light of the spectrometer output. The relationship is a function of wavelength and an output of the spectrometer due to the first-order light. The relationship is used to determine an estimated contribution of the second-order light to the output. Spectrometer errors introduced by the second-order light are corrected by adjusting the spectrometer output according to the estimated contribution of the second-order light.

Abstract: Reflectance systems and methods are described that use information of an intermediate reference signal to continuously monitor, detect and/or compensate for drift in a metrology system. The intermediate reference signal is present regardless of whether a sample is being measured. The reflectance system comprises components including a transmission element coupled to a sample area and a receiver. The transmission element is configured to route signals between components of the system. The signals include an illumination signal, and a sample signal resulting from interaction of the illumination signal with a sample when the sample is present in the sample area. The signals also include the reference signal that results from interaction of the illumination signal with one or more components of the system.

Abstract: Devices and methods for determining wafer orientation in spectral imaging are described. The devices and methods generate an image of a wafer that includes at least one spectral dimension. One or more properties are determined from the spectral dimension, and a map is generated based on the property. The generated map is compared to at least one other map, and data or information of the comparison is used to locate a region of the wafer, for example a measurement pad or other structure.

Abstract: A system is described that permits high-speed, high-resolution mapping of thicknesses (or other properties) of layers on patterned semiconductor wafers. The system comprises one or more spectrometers that each simultaneously image a plurality of spatial locations. In one example, the spectrometer comprises a two-dimensional CCD imager with one axis of the imager measuring spectral data and the other axis measuring spatial data. Spectral reflectance or transmission of the patterned wafer under test is obtained by passing the wafer under (or over) the imaging spectrometer(s) and taking sequential reflectance or transmission images for successive pluralities of spatial locations. The resulting spectral reflectance or transmission map can then be analyzed at discrete locations to determine the thicknesses or other properties of the layers at those locations.

Abstract: Methods and apparatus for measuring the thickness of at least one individual film added to, removed from, or within a sample, characterized by the use of a shift in a selected peak of thickness spectral data to estimate the thickness of the individual film.

Abstract: A spectrometer for providing multiple, simultaneous spectra from independent light sources is described characterized in that light from the multiple sources is directed to different portions of a diffraction grating, and the wavelength components of the resultant spectra are directed to at least one receptor.

Abstract: Methods and apparatus for film measurement and endpoint detection in a noisy environment, such as CMP processing of semiconductor wafers, are disclosed, characterized by the use of spectral analysis of intensity data derived from light reflected off the sample to estimate film thickness or detect an endpoint condition.