Abstract: The invention relates to a placement apparatus for the positionally accurate alignment and/or fitting of a first placement partner with at least one second placement partner complementary thereto, wherein the placement apparatus has at least one camera apparatus for recording separate images of the first placement partner or of a holding apparatus for the first placement partner and of the at least one second placement partner or of a holding apparatus for the at least one second placement partner and a position evaluation apparatus for creating an output data record from processing of the images, wherein the output data record has the visual image of the expected placement result. The invention also relates to a placement method.

Abstract: The invention relates to a method and an apparatus (22) for removing solder from a circuit board (5) from which electrical or electronic components have been removed at soldering points. The invention is addressed to the problem of offering a method and an apparatus by which the residual solder can be entirely removed from the circuit board (5) and by which even a large area on the circuit board (5) can be freed quickly and easily of the residual solder. This problem is solved by a method in which the solder after melting is pushed away from the soldering points by at least one pushing means (13a) or displaced therefrom by a plunger element, and is then removed from the circuit board (5). The apparatus (22) according to the invention makes available the means needed for the purpose.