Abstract: A planar antenna can include one or more high permeability objects that are added near the planar coil's tips. Further, the planar antenna includes a coil having two or more layers, with each layer having two or more turns. The planar antenna also has a restricted conductor arrangement, where there are a maximum number of turns arranged in any horizontal layer. A turn's conductor could be a single conductor or could be two (2) or more conductors arranged in parallel.

Abstract: Embodiments of the present disclosure are directed to using direct ink printing on chips or interposer pads to replace the other die bonding process, e.g., conductive adhesive, Anisotropic Conductive Film (ACF), solder, etc. Direct printing on contact pads of chips and/or interposers to replace using ACF bonding provides simplicity of manufacturing process, reduced cost by eliminating ACF, reduced interconnect resistance by eliminating ACF interface, and increased reliability by eliminating ACF bonding instability. Direct printing according to embodiments of the present disclosure can make complex design patterns with fine pitch capability (sub 10 micron is feasible by using aerosol jet printing, 30 microns or above for screen printing). Such direct printing can also enable roll to roll printing process for high volume production.

Abstract: A magnetic core assembly includes a first core having at least one gap and at least one second core provided within the at least one gap of the first core. The first core and the at least one second core are made of different materials. The at least one second core occupies a space no larger than the at least one gap of the first core.

Abstract: An input redundant power supply circuit includes a power converter, a relay switch unit including a first relay circuit coupled to a first power source and a second relay circuit coupled to a second power source, a control unit configured to control the relay switch unit so that the power converter is supplied power by the first or second power source, a high capacity capacitor powered by the power converter and a step-up converter coupled between the power converter and the high capacity capacitor. The step-up converter maintains a voltage across the high capacity capacitor higher than a voltage of the first power source or a voltage of the second power source when the relay switch unit switches from one of the first power source and the second power source to the other of the first power source and the second power source.

Abstract: Embodiments of the present disclosure are directed to a detailed lit indicator and touch detection in the same location through a metal surface. When the light behind the metal is turned off there will be no visible appearance of an indicator. When touched the metal will have no perceptible movement and never experience any deformation or evidence of usage over the life of the product.

Abstract: A power adapter is disclosed with retractable prongs to engage an outlet and obtain power therefrom, when extended, and be partially or entirely within the housing of the power adapter when retracted. To ensure safe operation, a channel is provided within the power adapter to accommodate the prongs when retracted and to accommodate the prongs travel as they pivot between extended and retracted. The channel is width-limited and/or has a length to make it impossible or, at least, exceptionally difficult for a human finger to come into contact with the prongs while the prongs are extended and sufficiently engaged with an outlet to obtain power therefrom.

Abstract: Heat management in electronic components is an important factor in managing the performance and longevity of such electronic components. By omitting a thermal interface layer and providing thermal vias between a heatsink and an electronic component, such as a surface mount technology (SMT) package, such components may improve thermal transfer to the heatsink and simplify assembly. Thermal vias may be fused during reflow to the heatsink and/or electronic component. As a benefit to the improved heat transfer provided, electronic components may operate at a lower temperature or be configured to perform greater heat-producing activities.

Abstract: An automatic injection device has an insertion needle configured to be inserted into a patient and a drug container which contains a pharmaceutical product and includes a plunger. The automatic injection device also has a fluid path which fluidly connects the drug container to the insertion needle, and a drive system configured to cause linear movement of the plunger to force the pharmaceutical product into the fluid path. The passive drive system has a movable element. The movable element has a shape memory alloy and is configured to change shape to move the plunger.

Abstract: Methods include receiving at least one electronic device including a sensor or an emitter, placing a cover over the sensor or emitter, placing the electronic device, including the cover, into a transfer mold system, encapsulating the electronic device with charge material, and removing a portion of the encapsulating charge material and the cover to expose the sensor or emitter to the environment.

Abstract: Methods, devices, and systems are provided for the molding and encapsulation of flexible electronic devices. The encapsulation includes providing a mold shell made from an encapsulation material, positioning a flexible electronic device in the mold shell, and dispensing an encapsulant, in a liquid form, around the flexible electronic device. The mold shell, the dispensed encapsulant, and the electronic device forms an integral encapsulation package when the encapsulant is cured. The mold shell and the encapsulant may be made from a same material and, once cured, become an integral part of the encapsulated flexible electronic device.

Abstract: An apparatus includes a first circuit path including a series combination of a primary winding of a transformer and a first secondary winding of the transformer and a second circuit path including a second secondary winding of the transformer. The primary winding of the transformer is magnetically coupled to the first and second secondary windings of the transformer and the primary winding of the transformer is detachably coupled to each of the first and second secondary windings of the transformer. The primary winding of the transformer is operative to generate a portion of an output current based on energy received from the primary winding of the transformer, and the second secondary winding of the transformer is operative to generate a remaining portion of the output current based on energy received from the second secondary winding of the transformer.

Abstract: An electronic component and a method of manufacturing an electronic component, the method including surface mounting electronic components to a printed circuit board (PCB), applying a flip-chip die integrated circuit (IC) to the PCB and underfilling the flip-chip IC to secure the PCB. The method also includes sintering a copper block to the PCB, where the copper block is in thermal communication with the IC and acts as a thermal path for removing heat generated by the flip-chip IC.

Abstract: A device and a method for insertion of a cannula into a user's tissue are disclosed. A patch pump comprising a non-linear needle path with a first bend may be provided. A rigid needle may be located in the non-linear needle path and may be composed of a material that allows the rigid needle to maintain a bend at the first bend when traversing the non-linear needle path. A movement mechanism may be configured to apply a first force on a first end of the rigid needle to cause the rigid needle to traverse the non-linear needle path from a first needle position to a second needle position. The cannula may receive a second force from a second end of the rigid needle when the movement mechanism applies the first force on the first end of the rigid needle and may be configured to traverse from a first cannula position to a second cannula position based on the second force.

Abstract: A package includes a first chip stack. The first chip stack includes a first chip including first bonding structures, a second chip including second bonding structures facing the first bonding structures and bonded to the first bonding structures, and a first electrical contact on the second chip. At least a portion of the first electrical contact does not overlap with the first chip in a plan view.

Abstract: An antimicrobial metallized thin film is provided that can be quickly and easily attached to surfaces of objects. This film includes a polymer substrate onto which a metallized layer is formed. The metallized layer comprises an exposed antimicrobial metal physical contact surface. Ions from this physical contact surface destroy the viral coating and ribonucleic acid of contacting viruses rendering the viruses inactive and noninfectious. The film can be attached via an adhesive layer disposed between and in contact with the polymer substrate and the communal surface. This arrangement allows the film to economically refurbish communal surfaces with a film overlay rather than completely replacing communal surfaces with antimicrobial materials. The film mitigates the likelihood of viruses such as coronaviruses, noroviruses, rhinoviruses, and the like from spreading due to contact with the refurbished communal surfaces.

Abstract: A rectifier includes a first input and a second input that receive an unrectified signal, a first circuit portion including a first transistor coupled to the second input, a second circuit portion including a second transistor coupled to the first input, a third circuit portion including a third transistor coupled to the first input, a fourth circuit portion including a fourth transistor coupled to the second input. The first, second, third, and fourth circuit portions are operable to convert the unrectified signal into a rectified signal. The rectifier includes a first adjustment circuit coupled to a gate of the third transistor, and a second adjustment circuit coupled to a gate of the fourth transistor. The first adjustment circuit and the second adjustment circuit are configured to control a dead time between an on-state of the third transistor and an on-state of the fourth transistor.

Abstract: A power converter with AFC (Automatic AC Feed Control) implements zero voltage switching when switching from a first input power supply to a second input power supply. The power converter with AFC includes a relay switchover circuit and control circuitry for selectively providing power to a connected power converter. The control circuitry uses sensed amplitude and phase values for the two input power supplies for determining when the first input power supply is lost and selectively connecting the second input power supply according to precise timing control to minimize component stress.

Abstract: Embodiments provide systems and methods for providing a dynamically variable focal plane in a waveguide-based display. Generally speaking, embodiments described herein provide an optical system that allows variable control of the focal length of the image emerging from the display engine into the waveguide. This can be a dynamic system that is controlled based upon the content being projected on the display. For a stereoscopic system, individual control of each eye can be provided. More specifically, embodiments comprise an electrically tunable lens element interposed between the output of the projection engine and the optical waveguide and a control unit to dynamically the tunable lens element to vary the focal length of the images provided to the waveguide display.

Abstract: An integrated heat exchanger has a heat exchanger within a circuit board. The circuit board can be a PCB having one or more electronic components coupled to its top-side surface. The conductive layers of the PCB include a first sub-set of electrically conductive interconnects and as second sub-set of electrically conductive interconnects. The first sub-set of conductive layers are electrically connected to each other and to the one or more electronic components. The second sub-set of conductive layers are electrically isolated from the first sub-set of conductive layers by intervening non-conductive layers such as prepreg. In this manner, the heat exchanger is electrically isolated from the one or more electronic components. The second sub-set of conductive layers include a dedicated top-side conductive layer to which a baseplate can be attached. The baseplate is also attached to the one or more electronic components via an electrically non-conductive gap filler.

Abstract: Methods, devices, and systems for tracking an asset are provided. In particular, a device is provided that includes an array of sensors and communications modules configured to detect tracking information, including environmental conditions and physical events, and report the tracking information along with a geographical location of the device to a control server across a wireless network. Upon receiving the tracking information, the control server interprets the information and generates tracking reports for the device configured to be displayed to a graphical user interface of a third-party communication device.