Patents Assigned to Focus Semiconductor Systems, Inc.
  • Patent number: 4845054
    Abstract: A method for low temperature chemical vapor deposition of an SiO.sub.2 based film on a semiconductor structure using selected alkoxysilanes, in particular tetramethoxysilane, trimethoxysilane and triethoxysilane which decompose pyrolytically at lower temperatures than TEOS (tetraethoxysilanes). Ozone is introduced into the reaction chamber to increase deposition rates, lower reaction temperatures and provide a better quality SiO.sub.2 film by generating a more complete oxidation. Ozone is also employed as a reactant for doping SiO.sub.2 based films with oxides of phosphorus and boron.
    Type: Grant
    Filed: June 29, 1987
    Date of Patent: July 4, 1989
    Assignee: Focus Semiconductor Systems, Inc.
    Inventor: James C. Mitchener
  • Patent number: 4834022
    Abstract: A CVD reactor has a unique geometry to control the thickness of a film formed on the surface of a substrate. The reactor is approximately cylindrical in shape. The base of the reactor is inclined at an angle of approximately 3.degree.-5.degree. from the vertical and has a central platform with a recessed well. The substrate is placed in the well so that the surface of the substrate on which the film is deposited does not protrude above the platform surface. The reactant gases are mixed in a region adjacent the cylindrical wall of the reactor and flow radially inward across the wafer surface. The thickness of the deposited film is controlled by contouring a plate positioned opposite the wafer surface so that the distance between the wafer surface and the plate, and hence the deposition rate, is controlled.
    Type: Grant
    Filed: October 27, 1987
    Date of Patent: May 30, 1989
    Assignee: Focus Semiconductor Systems, Inc.
    Inventor: Imad Mahawili
  • Patent number: 4673799
    Abstract: A fluidized bed heater for uniformly raising the surface temperature of semiconductor wafers. The heater includes a mantle having at least one planar surface for supporting wafers, a bed of particles adjacent the mantle which is fluidized by passing a gas through the particle bed, and a bed heater which heats the bed particles to a uniform temperature so that wafers supported on the planar surface are heated to a uniform temperature. A reactor is also described which contains a reactor chamber for processing semiconductor wafers and a fluidized bed heater for uniformly heating semiconductor wafers in the reactor chamber.
    Type: Grant
    Filed: March 1, 1985
    Date of Patent: June 16, 1987
    Assignee: Focus Semiconductor Systems, Inc.
    Inventor: Imad Mahawili