Patents Assigned to FormFactor, Inc.
  • Process of positioning groups of contact structures
    Patent number: 8148646
    Abstract: A contact apparatus can be made by providing a first substrate with electrically conductive terminals and second substrates each of which can have contact structures. Each of the contact structures can have a contact tip. The second substrates can be aligned such that contact tips of the contact structures are aligned substantially in a plane. An optical system can be used to monitor an actual position of the second substrates, and a mechanical system can be used to move the second substrates to aligned positions. The contact structures can be attached to ones of the terminals on the first substrate while the second substrates are in the aligned positions.
    Type: Grant
    Filed: September 29, 2008
    Date of Patent: April 3, 2012
    Assignee: FormFactor, Inc.
    Inventors: Li Fan, Michael J. Armstrong, John K. Gritters
  • Pre-aligner search
    Patent number: 8145349
    Abstract: Methods and systems, in one embodiment, for receiving a warped flexible wafer to be transferred between a first mechanism and a second mechanism are described. The method and system senses a first vacuum suction between the warped flexible wafer and the first mechanism. The warped flexible wafer is positioned to define a gap between the warped flexible wafer and the second mechanism. Methods and systems for closing the gap incrementally between the warped flexible wafer and the second mechanism are described. At each increment, the methods and systems detect whether a second vacuum suction is created between the warped flexible wafer and the second mechanism. When a second vacuum suction is detected between the warped flexible wafer and the second mechanism, the first vacuum suction between the warped flexible wafer and the first mechanism is released.
    Type: Grant
    Filed: May 14, 2008
    Date of Patent: March 27, 2012
    Assignee: FormFactor, Inc.
    Inventors: Bjorn Monteen, Gustaaf Ponder
  • Switch for use in microelectromechanical systems (MEMS) and MEMS devices incorporating same
    Patent number: 8138859
    Abstract: Embodiments of the present invention provide microelectromechanical systems (MEMS) switching methods and apparatus having improved performance and lifetime as compared to conventional MEMS switches. In some embodiments, a MEMS switch may include a resilient contact element comprising a beam and a tip configured to wipe a contact surface; and a MEMS actuator having an open position that maintains the tip and the contact surface in a spaced apart relation and a closed position that brings the tip into contact with the contact surface, wherein the resilient contact element and the MEMS actuator are disposed on a substrate and are movable in a plane substantially parallel to the substrate. In some embodiments, various contact elements are provided for the MEMS switch. In some embodiments, various actuators are provided for control of the operation of the MEMS switch.
    Type: Grant
    Filed: April 21, 2008
    Date of Patent: March 20, 2012
    Assignee: FormFactor, Inc.
    Inventors: John K. Gritters, Eric D. Hobbs, Sangtae Park, Jun Jason Yao
  • Probe card assembly with carbon nanotube probes having a spring mechanism therein
    Patent number: 8130007
    Abstract: Columns comprising a plurality of vertically aligned carbon nanotubes can be configured as electromechanical contact structures or probes. The columns can be grown on a sacrificial substrate and transferred to a product substrate, or the columns can be grown on the product substrate. The columns can be treated to enhance mechanical properties such as stiffness, electrical properties such as electrical conductivity, and/or physical contact characteristics. The columns can be mechanically tuned to have predetermined spring properties. The columns can be used as electromechanical probes, for example, to contact and test electronic devices such as semiconductor dies, and the columns can make unique marks on terminals of the electronic devices.
    Type: Grant
    Filed: October 13, 2007
    Date of Patent: March 6, 2012
    Assignee: FormFactor, Inc.
    Inventors: Benjamin N. Eldridge, John K. Gritters, Rodney I. Martens, Alexander H. Slocum, Onnik Yaglioglu
  • Electrical guard structures for protecting a signal trace from electrical interference
    Patent number: 8130005
    Abstract: A method of fabricating a guard structure can include depositing an insulating material over at least a portion of electrical signal conductors disposed on a component of a probe card assembly, and depositing an electrically conductive material onto the insulating material and at least a portion of electrical guard conductors disposed on the component of the probe card assembly. Each signal conductor can be disposed between a pair of the guard conductors. The probe card assembly can include a plurality of probes disposed to contact an electronic device to be tested. The signal conductors can be part of electrical paths within the probe card assembly to the probes.
    Type: Grant
    Filed: December 14, 2006
    Date of Patent: March 6, 2012
    Assignee: FormFactor, Inc.
    Inventor: Keith J. Breinlinger
  • Stiffener assembly for use with testing devices
    Patent number: 8120373
    Abstract: A stiffener assembly for use with testing devices is provided herein. In some embodiments, a stiffener assembly for use with testing devices can be part of a probe card assembly that can include a stiffener assembly comprising an upper stiffener coupled to a plurality of lower stiffeners; and a substrate constrained between the upper stiffener and the plurality of lower stiffeners, the stiffener assembly restricting non-planar flex of the substrate while facilitating radial movement of the substrate with respect to the stiffener assembly.
    Type: Grant
    Filed: February 7, 2011
    Date of Patent: February 21, 2012
    Assignee: FormFactor, Inc.
    Inventors: Eric D. Hobbs, Andrew W. McFarland
  • Method for improving motion times of a stage
    Patent number: 8120304
    Abstract: Methods and systems for, in one embodiment, accelerating a stage through a clearance height in a first direction and decelerating the stage in the first direction while accelerating in a second direction are shown. The stage is moved in a third direction and a determination is made whether the stage movement in the second direction is below a threshold value before continuing to move the stage further in the third direction. The first direction is perpendicular to the second direction and is parallel and opposite to the third direction.
    Type: Grant
    Filed: December 12, 2008
    Date of Patent: February 21, 2012
    Assignee: FormFactor, Inc.
    Inventors: Sun Yalei, Uday Nayak, Richard J. Casler, Jr., Thomas Rohrs
  • Method and apparatus for processing failures during semiconductor device testing
    Patent number: 8122309
    Abstract: Methods and apparatus for processing failures during semiconductor device testing are described. Examples of the invention can relate to testing a device under test (DUT). Fail capture logic can be provided, coupled to test probes and memory, to indicate only first failures of failures detected on output pins of the DUT during a test for storage in the memory.
    Type: Grant
    Filed: March 11, 2008
    Date of Patent: February 21, 2012
    Assignee: FormFactor, Inc.
    Inventor: Todd Ryland Kemmerling
  • Microspring array having reduced pitch contact elements
    Patent number: 8115504
    Abstract: Embodiments of microspring arrays and methods for fabricating and using same are provided herein. In some embodiments, a microspring array may include at least two lithographically formed resilient contact elements, each resilient contact element having a beam and a tip for contacting a device to be tested, wherein the beams extend in substantially the same direction relative to a first end of the beams, and wherein the ends of the at least two beams are separated by a distance defining a central region and wherein the respective tips of the at least two beams extend away from the beams in a non-zero, non-perpendicular direction into the central region.
    Type: Grant
    Filed: December 19, 2008
    Date of Patent: February 14, 2012
    Assignee: FormFactor, Inc.
    Inventor: John K. Gritters
  • Method and apparatus for terminating a test signal applied to multiple semiconductor loads under test
    Patent number: 8098076
    Abstract: Apparatus for terminating a test signal applied to multiple semiconductor loads under test is described—for example apparatus for interfacing a test signal between a tester and a semiconductor device under test (DUT). In some examples, a probe card assembly may include at least one probe substrate each having test probes configured to contact test features of a DUT; a wiring substrate, coupled to the at least one probe substrate, having a connector configured for coupling with a source termination of a tester; a signal path formed on and/or in the wiring substrate and the at least one probe substrate, the signal path having a trace and trace stubs fanning out from the trace, an input of the trace being coupled to the connector and outputs of the trace stubs being coupled to the test probes; and a resistive termination coupled between the trace and at least one potential.
    Type: Grant
    Filed: April 1, 2009
    Date of Patent: January 17, 2012
    Assignee: FormFactor, Inc.
    Inventors: Guang Chen, Charles Miller, David Pritzkau
  • TESTING TECHNIQUES FOR THROUGH-DEVICE VIAS
    Publication number: 20120007626
    Abstract: Techniques for testing an electronic device with through-device vias can include using a probe card assembly with probes for contacting connection structures of the electronic device including ends of through-device vias of the electronic device. A pair of the probes can be electrically connected in the probe card assembly and can thus contact and form a direct return loop from one through-device via to another through-device via of a pair of the through-device vias with which the pair of probes is in contact. The electronic device can include test circuitry for driving a test signal onto the one of the through-device vias and a receiver for detecting the test signal on the other of the through-device vias.
    Type: Application
    Filed: June 29, 2011
    Publication date: January 12, 2012
    Applicant: FORMFACTOR, INC.
    Inventor: Benjamin N. Eldridge
  • Method and apparatus for testing semiconductor devices with autonomous expected value generation
    Patent number: 8095841
    Abstract: Method and apparatus for testing semiconductor devices with autonomous expected value generation is described. Examples of the invention can relate to apparatus for interfacing a tester and a semiconductor device under test (DUT). An apparatus can include output processing logic configured to receive test result signals from the DUT responsive to testing by the tester, the output processing logic voting a logic value of a majority of the test result signals as a correct logic value; and memory configured to store indications of whether each of the test result signals has the correct logic value.
    Type: Grant
    Filed: August 19, 2008
    Date of Patent: January 10, 2012
    Assignee: FormFactor, Inc.
    Inventor: Todd Ryland Kemmerling
  • Method of expanding tester drive and measurement capability
    Patent number: 8067951
    Abstract: A probe card assembly can comprise an interface, which can be configured to receive from a tester test signals for testing an electronic device. The probe card assembly can further comprise probes for contacting the electronic device and electronic driver circuits for driving the test signals to ones of the probes.
    Type: Grant
    Filed: July 7, 2009
    Date of Patent: November 29, 2011
    Assignee: FormFactor, Inc.
    Inventor: Charles A. Miller
  • METHOD AND APPARATUS FOR TESTING DEVICES USING SERIALLY CONTROLLED INTELLIGENT SWITCHES
    Publication number: 20110267085
    Abstract: Methods and apparatus for testing devices using serially controlled intelligent switches have been described. In some embodiments, a probe card assembly can be provided that includes a plurality of integrated circuits (ICs) serially coupled to form a chain, the chain coupled to at least one serial control line, the plurality of ICs including switches coupled to test probes, each of the switches being programmable responsive to a control signal on the at least one serial control line.
    Type: Application
    Filed: July 8, 2011
    Publication date: November 3, 2011
    Applicant: FORMFACTOR, INC.
    Inventors: Tommie Edward Berry, A. Nicholas Sporck
  • Microelectronic contact structure
    Patent number: 8033838
    Abstract: Spring contact elements are fabricated by depositing at least one layer of metallic material into openings defined on a sacrificial substrate. The openings may be within the surface of the substrate, or in one or more layers deposited on the surface of the sacrificial substrate. Each spring contact element has a base end portion, a contact end portion, and a central body portion. The contact end portion is offset in the z-axis (at a different height) than the central body portion. The base end portion is preferably offset in an opposite direction along the z-axis from the central body portion. In this manner, a plurality of spring contact elements are fabricated in a prescribed spatial relationship with one another on the sacrificial substrate.
    Type: Grant
    Filed: October 12, 2009
    Date of Patent: October 11, 2011
    Assignee: FormFactor, Inc.
    Inventors: Benjamin N. Eldridge, Gary W. Grube, Igor Y. Khandros, Gaetan L. Mathieu
  • Method of repairing segmented contactor
    Patent number: 8011089
    Abstract: A method of fabricating a large area, multi-element contactor. A segmented contactor is provided for testing semiconductor devices on a wafer that comprises a plurality of contactor units mounted to a substrate. The contactor units are formed, tested, and assembled to a backing substrate. The contactor units may include leads extending laterally for connection to an external instrument such as a burn-in board. The contactor units include conductive areas such as pads that are placed into contact with conductive terminals on devices under test.
    Type: Grant
    Filed: August 25, 2009
    Date of Patent: September 6, 2011
    Assignee: FormFactor, Inc.
    Inventors: Mohammad Eslamy, David V. Pedersen, Harry D. Cobb
  • Process and apparatus for adjusting traces
    Patent number: 8015536
    Abstract: Traces routed through a computer depiction of a routing area of an electronics system comprise a plurality of connected nodes. Forces are assigned to the nodes, and the nodes are moved in accordance with the forces. The forces may be based on such things as the proximity of the nodes to each other and to obstacles in the routing area. This tends to smooth, straighten and/or shorten the traces, and may also tend to correct design rule violations.
    Type: Grant
    Filed: October 28, 2008
    Date of Patent: September 6, 2011
    Assignee: FormFactor, Inc.
    Inventor: Mac Stevens
  • Electronic device with integrated micromechanical contacts and cooling system
    Patent number: 7999375
    Abstract: An electronic device can comprise a semiconductor die on which can be formed a micromechanical system. The micromechanical system can comprise a plurality of electrically conductive elongate, contact structures, which can be disposed on input and/or output terminals of the semiconductor die. The micromechanical system can also comprise a cooling structure disposed on the semiconductor die.
    Type: Grant
    Filed: October 11, 2006
    Date of Patent: August 16, 2011
    Assignee: FormFactor, Inc.
    Inventors: Eric D. Hobbs, Gaetan L. Mathieu
  • Calibration substrate
    Patent number: 7994803
    Abstract: A calibration substrate includes a plurality of input terminals, a detector coupled to the input terminals, and an output terminal. The calibration substrate can be used for calibrating and/or deskewing communications channels.
    Type: Grant
    Filed: September 29, 2009
    Date of Patent: August 9, 2011
    Assignee: FormFactor, Inc.
    Inventor: Charles A. Miller
  • Method of designing a probe card apparatus with desired compliance characteristics
    Patent number: 7990164
    Abstract: A probe card apparatus is configured to have a desired overall amount of compliance. The compliance of the probes of the probe card apparatus is determined, and an additional, predetermined amount of compliance is designed into the probe card apparatus so that the sum of the additional compliance and the compliance of the probes total the overall desired compliance of the probe card apparatus.
    Type: Grant
    Filed: June 6, 2008
    Date of Patent: August 2, 2011
    Assignee: FormFactor, Inc.
    Inventor: Benjamin N. Eldridge