Abstract: A novel method for firmly bonding metal and ceramics comprising the steps of applying a composite plating composition consisting of a metal containing plating solution and fine particles of ceramic on a surface of metal to which the ceramic is to be bonded, thereby forming a metal plating layer on the surface having partially projected fine particles of ceramic, and then firing the coated metal in order to fuse the ceramic thereto.
Type:
Grant
Filed:
December 31, 1981
Date of Patent:
December 3, 1985
Assignees:
Four Brain Company Ltd., Kyoto Ceramic Company Ltd.