Abstract: A manufacturing method for a metallic housing of an electronic device is provided. The method includes providing a die-casting mold including a male die and a female die; positioning an outer frame in a cavity of the female die, the outer frame including a plurality of latching portions protruding from an inner surface inwardly and a plurality of latching grooves, each latching portion including at least one receiving groove; assembling the male die to the female die; casting pressured molten metal-alloy into the cavity to form an inner structural member embedded in the outer frame, the inner structural member including a plurality of engaging portions respectively embedded in the plurality of receiving grooves, and a plurality of matching portions respectively embedded in the plurality of latching grooves; dissembling the male die from the female die; and removing the outer frame and the inner structural member from the female die.

Abstract: A manufacturing method for a metallic housing of an electronic device is provided. The method includes providing a die-casting mold, including a male die and a female die engaging with the male die, the male die defining a pouring gate therein, and the female die defining a cavity therein corresponding to the pouring gate; positioning a metallic outer case in the cavity of the female die as an insert; assembling the male die to the female die to cover the cavity, thereby communicating the pouring gate with the cavity; casting pressured molten metal-alloy into the cavity via the pouring gate to form an inner structural member embedded in an inner side of the outer case; dissembling the male die from the female die to expose the cavity, and removing the outer case and the inner structural member from the female die.

Abstract: An exemplary base includes a heat absorber and clips attached to the heat absorber. The heat absorber includes a top surface and a bottom surface. A pair of receiving grooves is defined in opposite lateral sides of the heat absorber, respectively. Each receiving groove is located above a level of the bottom surface and below a level of the top surface. Each clip includes a positioning beam. The positioning beam is received in a corresponding one of the receiving grooves with a portion of the heat absorber adjacent to the positioning beam deformed and fixed in the positioning beam thereby fixing the positioning beam in the receiving groove. A heat dissipating module having the base is also provided.

Abstract: A heat dissipation device includes a base, a fin assembly mounted on a top surface of the base, and a heat absorber arranged at a bottom surface of the base. The bottom surface of the base defines a recess corresponding to the heat absorber. The heat absorber is embedded in the recess. A fixing plate is positioned at the bottom surface of the base to cover the recess and define a sealed/airtight cavity between the fixing plate and the base. A top end of the heat absorber is received in the sealed/airtight cavity. A top end of the heat absorber extends through the fixing plate to expose out of the sealed/airtight cavity. A flexible sheet is totally received in the sealed/airtight cavity to buffer a stress generated by assembling the heat dissipation device with external elements.

Abstract: An electronic device includes an electronic component and a heat dissipating casing configured to dissipate heat from the electronic component. The casing includes top and bottom sides of the heat dissipating casing forming a sealed chamber, and a pore structure formed within the sealed chamber. The sealed chamber is configured to receive a working medium and the pore structure is configured to absorb at least a portion of the working medium, whereby the heat generated from the electronic component is dissipated by a phase change of the working medium.

Abstract: A method for manufacturing a heat pipe includes following steps: providing a tube; providing a rod; inserting the rod in the circular tube, a receiving portion is formed between an inner face of the tube and the upper portion of the rod; providing an amount of metal powder and filling the metal powder into the receiving portion; sintering the metal powder at a high temperature to form a first wick structure adhered on the inner face of the tube and then drawing the rod out of the tube; injecting a working medium into the tube and sealing the tube to form the heat pipe.

Abstract: A magnet case for a rotor includes a hollow cylindrical supporting body for accommodating two magnetic bands, an annular flange extending outwardly from a top end of the supporting body, and a positioning plate extending inwardly from a bottom end of the supporting body. The annular flange of the magnet case has two spaced notches defined in an outer periphery thereof, and the two spaced notches are configured to reduce vibration of a cooling fan associated with the rotor during operation of the cooling fan. A rotor incorporating the magnet case is also provided.

Abstract: An exemplary cooling fan includes a base, a central tube formed at the base, a stator, and a rotor being rotatable relative to the stator. The central tube is made of polyoxymethylene. The central tube includes a bottom plate mounted on the base and a peripheral sidewall extending upwardly from a peripheral edges of the bottom plate. The bottom plate and the sidewall cooperatively define a blind hole therebetween. The stator is mounted around the sidewall of the central tube. The rotor includes a hub and a shaft extending from the hub. The shaft includes a free end received in the blind hole and directly abutting the bottom plate.

Abstract: An LED illumination includes a heat sink, and an LED module mounted on the heat sink. The heat sink includes a base, a receiving tube extending upwardly from a first face of the base, and a plurality of fins arranged on the first face of the base and surrounding the receiving tube. The plurality of fins extends radially and outwardly beyond an outer periphery of the base in relation to the receiving tube. A band engages and encloses the plurality of fins. A plurality of air tunnels are defined between the base, the band and the plurality of fins. The LED module is mounted on a second face of the base opposite to the first face.

Abstract: A wall lamp includes a lamp body, a connector, a power box, a light emitting unit and a driving device. The light emitting unit is fixed on a bottom of the lamp body. The driving device is received in the power box and supplies power for the light emitting unit. The connector includes a first connecting part and a second connecting part. The first connecting part is fixed on a top of the lamp body. The second connecting part is fixed on a top of the power box. The first connecting part is rotationally connected to the second connecting part, thereof adjusting illumination angle of the light emitting unit and making the wall lamp in a closed state or unfolded state.

Abstract: An exemplary fan includes a hub and an impeller. The hub is made of metal, and includes a flange. The impeller is made of plastic. The impeller is formed around the hub and has the flange embedded therein. A method for manufacturing the fan is also provided.

Abstract: A cover configured to be attached to, and cover a portion of, a handheld electronic device. The cover includes a shell having a first side and a second side and a wireless charging receiver module connectable to the handheld electronic device. When attached to the handheld electronic device the first side of the shell faces the handheld electronic device. The wireless charging receiver module is positioned on the first side of the shell.

Abstract: An exemplary centrifugal fan includes a housing and an impeller received in the housing. The housing defines an air inlet and an air outlet thereof. Airflow driven by the impeller flows out of the housing via the air outlet. The housing further defines an opening adjacent to one end of the air outlet. The ambient air out of the centrifugal fan enters the housing via the opening, and flows out of the housing via the air outlet.

Abstract: An exemplary flat heat pipe includes a hollow, flattened casing and a first wick structure and a second wick structure received in the casing. The casing includes a top plate and a bottom plate opposite to the top plate. The first wick structure is formed by weaving wires, and the second wick structure is made of sintered metal powder. The first and second wick structures are disposed at inner sides of the bottom and top plates of the casing, respectively. The first and second wick structures contact each other. The casing defines two vapor channels at opposite lateral sides of the combined first and second wick structures, respectively.

Abstract: An exemplary base includes a heat absorber and clips attached to the heat absorber. The heat absorber includes a top surface and a bottom surface. A pair of receiving grooves is defined in opposite lateral sides of the heat absorber, respectively. Each receiving groove is located above a level of the bottom surface and below a level of the top surface. Each clip includes a positioning beam. The positioning beam is received in a corresponding one of the receiving grooves with a portion of the heat absorber adjacent to the positioning beam deformed and fixed in the positioning beam thereby fixing the positioning beam in the receiving groove. A heat dissipating module having the base is also provided.

Abstract: A plate type heat pipe includes a sealed tube, a chamber defined in the tube, and working medium received in the chamber. A mesh wick structure is attached to an inner wall of the tube. In one version of the plate type heat pipe, the wick structure defines a single opening. The opening communicates the chamber and thereby provides additional space for flow of vaporized working medium inside the tube. In other versions of the plate type heat pipe, the wick structure defines two or more openings.

Abstract: A method for conversion treating a surface of a magnesium alloy workpiece includes the following steps: providing a magnesium alloy workpiece, degreasing the magnesium alloy workpiece, acid pickling the magnesium alloy workpiece in a first acid pickling treatment step, surface conditioning the magnesium alloy workpiece in a first surface conditioning treatment step, acid pickling the magnesium alloy workpiece in a second acid pickling treatment step, surface conditioning the magnesium alloy workpiece in a second surface conditioning treatment step, pre-phosphating the magnesium alloy workpiece in a pre-phosphating treatment step, and phosphating the magnesium alloy workpiece in a phosphating treatment step to form a phosphating film on the surface of the magnesium alloy workpiece.