Abstract: A soldering machine with two parallel guide profiles for revolving chains provided for with soldering fingers, include a succession of a fluxer, a preheater and a solder bath along with the guide profiles extend. One profile is mounted fixed laterally above the succession and the other is adjustable directly above the succession. Thereby the adjustable guide profile is heated up more, especially under the action of the preheater, whereby, due to elongations of the guide profile, problems arise in the conduction of printed circuit boards held at the revolving chains by means of soldering fingers. To eliminate this problem, the invention provides that each guide profile is provided with at least one longitudinally extending coolant duct and that each coolant duct is connected to a pump for a coolant. Thereby the temperature actions on the adjustable guide profile 5 are compensated.