Abstract: A mechanism for cutting film supplied in the form of a long strip into segments having a predetermined length and transporting the segments to a subsequent processing stages wherein cutting, positioning and holding of the film are performed substantially simultaneously with an apparatus having a simple construction. A film suction platen is provided having a plurality of holes formed therein. A lowered pressure is provided on the side of the platen opposite that on which film segments of a predetermined length are fed from a supply reel. A cutting mechanism is mounted alongside the platen to cut the segments after they have been fed. After the segments have been cut, and following exposure while on the film suction platen, the film suction platen is reciprocated to a take-out section which extracts the exposed film segments from the surface of the film suction platen and feeds them to the processing stage.