Abstract: The present invention is an acceleration sensor chip comprising a support frame part and a sensor structure. The sensor structure includes a displaceable weight part with a magnetic thin film formed on the surface and at least one beam part for connecting the weight part to the frame part. The support frame part and sensor structure are formed on a silicon substrate through an insulating layer. The insulating layer between the sensor structure and the silicon substrate is removed and a coil is formed to surround the weight part on the support frame part at the periphery of the weight part. In some embodiments, the accelerator sensor chip comprises a plurality of such sensor structures.