Patents Assigned to Future-Shape GmbH
  • Publication number: 20110027520
    Abstract: A method for producing a floor covering substrate is provided, wherein at least one electronic device is embedded within a layer, which includes at least one curable material; wherein the at least one electronic device is embedded in a substrate layer and/or on a substrate layer; wherein the substrate layer, including the electronic device, is embedded in a layer, which includes at least one curable material; wherein the substrate layer that includes a porous or meshed structure or a reinforcement fabric, which is penetrable for the at least one curable material.
    Type: Application
    Filed: February 20, 2009
    Publication date: February 3, 2011
    Applicant: Future-Shape GmbH
    Inventors: Christl Lauterbach, Axel Steinhage, Andre Bartel
  • Patent number: 7230610
    Abstract: Input apparatus including at least one textile fabric carrier, at least one flexible, wire-and/or thread-like electrical conductor comprising at least one weft and/or warp thread of the fabric carrier, and at least one electrically conductive, flexible key device which is electrically connected to a key connection of the conductor, wherein the conductor is designed for the connection of an evaluation device.
    Type: Grant
    Filed: June 14, 2004
    Date of Patent: June 12, 2007
    Assignee: Future-Shape GmbH
    Inventors: Stefan Jung, Christl Lauterbach